Yuanjing Jane Li

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
- Patent number 11,545,450
- Issue date Jan 3, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW STRESS PLANE DESIGN FOR IC PACKAGE SUBSTRATE
- Publication number 20230103147
- Publication date Mar 30, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...
- Publication number 20220020709
- Publication date Jan 20, 2022
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS