Yuci Shen

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D cooling block for heat dissipation in electronic devices
- Patent number 12,040,251
- Issue date Jul 16, 2024
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid allowing for liquid metal thermal interfacing materials in a li...
- Patent number 11,373,931
- Issue date Jun 28, 2022
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink aspect of heat dissipating lid and reservoir structure fl...
- Patent number 11,296,010
- Issue date Apr 5, 2022
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reservoir structure and system forming gap for liquid thermal inter...
- Patent number 11,177,193
- Issue date Nov 16, 2021
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-cloth-based method for making TSV substrates
- Patent number 10,685,851
- Issue date Jun 16, 2020
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating lid with reservoir structure and associated lidded...
- Patent number 10,643,924
- Issue date May 5, 2020
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ingot for TSV substrates and method for making the same
- Patent number 9,397,035
- Issue date Jul 19, 2016
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Direct Vapor Chamber for Heat Dissipation in Electronic Devices
- Publication number 20250062187
- Publication date Feb 20, 2025
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Object with Self Sealing Plug Allowing for a Therm...
- Publication number 20230413476
- Publication date Dec 21, 2023
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Allowing for a Thermal Interface Material with Fluidity in a Li...
- Publication number 20230298960
- Publication date Sep 21, 2023
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid with Self Sealing Plug Allowing for a Thermal Interface Materia...
- Publication number 20230298965
- Publication date Sep 21, 2023
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lidded Flip Chip Package Allowing for a Thermal Interface Material...
- Publication number 20230282545
- Publication date Sep 7, 2023
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ALLOWING FOR LIQUID METAL THERMAL INTERFACING MATERIALS IN A LI...
- Publication number 20220216129
- Publication date Jul 7, 2022
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK ASPECT OF HEAT DISSIPATING LID AND RESERVOIR STRUCTURE FL...
- Publication number 20200350228
- Publication date Nov 5, 2020
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESERVOIR STRUCTURE AND SYSTEM FORMING GAP FOR LIQUID THERMAL INTER...
- Publication number 20200350231
- Publication date Nov 5, 2020
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID-CLOTH-BASED METHOD FOR MAKING TSV SUBSTRATES
- Publication number 20190237342
- Publication date Aug 1, 2019
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Package Using A Substrate With A Multi-Region Core...
- Publication number 20170135203
- Publication date May 11, 2017
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CORE WITH EFFECTIVE THROUGH SUBSTRATE VIAS AND METHOD FOR...
- Publication number 20170040247
- Publication date Feb 9, 2017
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INGOT FOR TSV SUBSTRTAES AND METHOD FOR MAKING THE SAME
- Publication number 20150140286
- Publication date May 21, 2015
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING A CHIP CONSTRAINT MEANS
- Publication number 20140167243
- Publication date Jun 19, 2014
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CAP FOR USE WITH FLIP CHIP PACKAGE
- Publication number 20140091461
- Publication date Apr 3, 2014
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

3D cooling block for heat dissipation in electronic devices

Lid allowing for liquid metal thermal interfacing materials in a li...

Heat sink aspect of heat dissipating lid and reservoir structure fl...

Reservoir structure and system forming gap for liquid thermal inter...

Hybrid-cloth-based method for making TSV substrates

Heat-dissipating lid with reservoir structure and associated lidded...

Integrated ingot for TSV substrates and method for making the same

Patents Applicationslast 30 patents

Direct Vapor Chamber for Heat Dissipation in Electronic Devices

Heat Dissipating Object with Self Sealing Plug Allowing for a Therm...

Lid Allowing for a Thermal Interface Material with Fluidity in a Li...

Lid with Self Sealing Plug Allowing for a Thermal Interface Materia...

Lidded Flip Chip Package Allowing for a Thermal Interface Material...

LID ALLOWING FOR LIQUID METAL THERMAL INTERFACING MATERIALS IN A LI...

HEAT SINK ASPECT OF HEAT DISSIPATING LID AND RESERVOIR STRUCTURE FL...

RESERVOIR STRUCTURE AND SYSTEM FORMING GAP FOR LIQUID THERMAL INTER...

HYBRID-CLOTH-BASED METHOD FOR MAKING TSV SUBSTRATES

Microelectronic Package Using A Substrate With A Multi-Region Core...

SUBSTRATE CORE WITH EFFECTIVE THROUGH SUBSTRATE VIAS AND METHOD FOR...

INTEGRATED INGOT FOR TSV SUBSTRTAES AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGES USING A CHIP CONSTRAINT MEANS

DIE CAP FOR USE WITH FLIP CHIP PACKAGE