Yude Chu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package structure
- Patent number 10,587,037
- Issue date Mar 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 9,997,477
- Issue date Jun 12, 2018
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,502,377
- Issue date Nov 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 9,502,758
- Issue date Nov 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Hsin-Lung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device and method of eliminating defective bonding wire
- Patent number 9,355,989
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,337,250
- Issue date May 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having vertically mounted passive devices und...
- Patent number 6,781,222
- Issue date Aug 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20160225728
- Publication date Aug 4, 2016
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20160081234
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150145747
- Publication date May 28, 2015
- Siliconware Precision Industries Co., Ltd.
- Hsin-Lung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING WIRE BONDING STRUCTURE
- Publication number 20150028081
- Publication date Jan 29, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140353850
- Publication date Dec 4, 2014
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20140210672
- Publication date Jul 31, 2014
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140203395
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and fabricating method thereof
- Publication number 20020086500
- Publication date Jul 4, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Electronic package structure

Method of manufacturing semiconductor package

Semiconductor package and fabrication method thereof

Electronic package and fabrication method thereof

Wire bonding device and method of eliminating defective bonding wire

Semiconductor package and method of manufacturing the same

Method for fabricating wire bonding structure

Semiconductor package having vertically mounted passive devices und...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE

PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING WIRE BONDING STRUCTURE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and fabricating method thereof