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last 30 patents
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Patent Application
MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...
Publication number
20240030146
Publication date
Jan 25, 2024
Nantong ACCESS Semiconductor CO.,LTD.
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220302037
Publication date
Sep 22, 2022
Nantong ACCESS Semiconductor CO.,LTD.
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...
Publication number
20220287184
Publication date
Sep 8, 2022
Nantong ACCESS Semiconductor CO.,LTD.
Xianming CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR