Yue DENG

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT HIERARCHY FOR HETEROGENEOUS ELECTRONIC DEVICE P...
- Publication number 20230197660
- Publication date Jun 22, 2023
- Intel Corporation
- Yue DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...
- Publication number 20230197543
- Publication date Jun 22, 2023
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX
- Publication number 20230101629
- Publication date Mar 30, 2023
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM SURROUNDING A DIE ON A SUBSTRATE
- Publication number 20230086920
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...
- Publication number 20230091379
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS