Yue Li

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Markham, CA

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip substrate with multi-capacitor footprint
- Patent number 8,012,874
- Issue date Sep 6, 2011
- ATI Technologies ULC
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip Substrate with Multi-Capacitor Footprint
- Publication number 20090152690
- Publication date Jun 18, 2009
- Yue Li
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Under Bump Routing Layer Method and Apparatus
- Publication number 20090032941
- Publication date Feb 5, 2009
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD
- Publication number 20080245555
- Publication date Oct 9, 2008
- ATI Technologies ULC
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR