YUE-RONG WANG

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Zhongshan, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ASSEMBLY FOR CHIP AND METHOD OF MANUFACTURING SAME
- Publication number 20150048504
- Publication date Feb 19, 2015
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- YUE-RONG WANG
- H01 - BASIC ELECTRIC ELEMENTS