Yuebin ZHU

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding device
- Patent number 11,081,380
- Issue date Aug 3, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding device and bonding method thereof
- Patent number 11,037,900
- Issue date Jun 15, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal chip batch-bonding apparatus and method
- Patent number 10,770,320
- Issue date Sep 8, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and method
- Patent number 10,748,800
- Issue date Aug 18, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuebin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reaction force diversion mechanism, motor device and photolithograp...
- Patent number 10,691,025
- Issue date Jun 23, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Baoliang Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Moving platform device, exposure device and lithography machine
- Patent number 10,353,297
- Issue date Jul 16, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Lili Ge
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Silicon wafer edge protection device with collision protection func...
- Patent number 10,041,548
- Issue date Aug 7, 2018
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Jingli Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography machine workpiece table and vertical position initializ...
- Patent number 9,760,022
- Issue date Sep 12, 2017
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feihong Liao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
UNIVERSAL CHIP BATCH-BONDING APPARATUS AND METHOD
- Publication number 20200013647
- Publication date Jan 9, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING DEVICE
- Publication number 20190378741
- Publication date Dec 12, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
A CHIP BONDING DEVICE AND BONDING METHOD THEREOF
- Publication number 20190164930
- Publication date May 30, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND METHOD
- Publication number 20190088516
- Publication date Mar 21, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuebin ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVING PLATFORM DEVICE, EXPOSURE DEVICE AND LITHOGRAPHY MACHINE
- Publication number 20190025712
- Publication date Jan 24, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Lili GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTION FORCE DIVERSION MECHANISM, MOTOR DEVICE AND PHOTOLITHOGRAP...
- Publication number 20190004433
- Publication date Jan 3, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Baoliang WANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
LITHOGRAPHY MACHINE WORKPIECE TABLE AND VERTICAL POSITION INITIALIZ...
- Publication number 20170017168
- Publication date Jan 19, 2017
- SHANGHAI MICRO ELECTRONICS EQUIPMENT Co., LTD.
- Feihong LIAO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SILICON WAFER EDGE PROTECTION DEVICE WITH COLLISION PROTECTION FUNC...
- Publication number 20160341256
- Publication date Nov 24, 2016
- SHANGHAI MICRO ELECTRONICS EQUIPMENT Co., LTD.
- Jingli HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Chip bonding device

Chip bonding device and bonding method thereof

Universal chip batch-bonding apparatus and method

Chip bonding apparatus and method

Reaction force diversion mechanism, motor device and photolithograp...

Moving platform device, exposure device and lithography machine

Silicon wafer edge protection device with collision protection func...

Lithography machine workpiece table and vertical position initializ...

Patents Applicationslast 30 patents

UNIVERSAL CHIP BATCH-BONDING APPARATUS AND METHOD

CHIP BONDING DEVICE

A CHIP BONDING DEVICE AND BONDING METHOD THEREOF

CHIP BONDING APPARATUS AND METHOD

MOVING PLATFORM DEVICE, EXPOSURE DEVICE AND LITHOGRAPHY MACHINE

REACTION FORCE DIVERSION MECHANISM, MOTOR DEVICE AND PHOTOLITHOGRAP...

LITHOGRAPHY MACHINE WORKPIECE TABLE AND VERTICAL POSITION INITIALIZ...

SILICON WAFER EDGE PROTECTION DEVICE WITH COLLISION PROTECTION FUNC...