Membership
Tour
Register
Log in
Yueh-Chiung Chang
Follow
Person
Taichung Hsien, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating electronic package structure
Patent number
11,476,572
Issue date
Oct 18, 2022
Siliconware Precision Industries Co., Ltd.
Chih-Yuan Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package structure and fabrication method thereof
Patent number
10,587,041
Issue date
Mar 10, 2020
Silicon Precision Industries Co., Ltd.
Chih-Yuan Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module
Patent number
10,115,712
Issue date
Oct 30, 2018
Siliconware Precision Industries Co., Ltd.
Shao-Chueh Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of packaging substrate
Patent number
9,269,677
Issue date
Feb 23, 2016
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, packaging substrate and fabrication method t...
Patent number
8,901,729
Issue date
Dec 2, 2014
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure of disturbing plate having down set
Patent number
6,414,379
Issue date
Jul 2, 2002
Siliconware Precision Industries Co., Ltd.
Yueh-Chiung Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE
Publication number
20200161756
Publication date
May 21, 2020
Siliconware Precision Industries Co., Ltd.
Chih-Yuan Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20180090835
Publication date
Mar 29, 2018
Siliconware Precision Industries Co., Ltd.
Chih-Yuan Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC STACK STRUCTURE HAVING PASSIVE ELEMENTS AND METHOD FOR F...
Publication number
20180047711
Publication date
Feb 15, 2018
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Module
Publication number
20170048981
Publication date
Feb 16, 2017
Siliconware Precision Industries Co., Ltd.
Shao-Chueh Hu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
Publication number
20150050782
Publication date
Feb 19, 2015
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE AND FABRICATION METHOD T...
Publication number
20130161837
Publication date
Jun 27, 2013
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface-mount-enhanced lead frame and method for fabricating semico...
Publication number
20040238923
Publication date
Dec 2, 2004
Siliconware Precision Industries Co., Ltd.
Te-Haw Lee
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...