Yueh-Lung LIN

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,177,221
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Hua Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and method of manufacturing the same
- Patent number 10,147,835
- Issue date Dec 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Po-Nien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package manufacturing method and structure thereof
- Patent number 7,790,505
- Issue date Sep 7, 2010
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130165
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130163
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yueh-Ju LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210118806
- Publication date Apr 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Hua TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180269347
- Publication date Sep 20, 2018
- Advanced Semiconductor Engineering, Inc.
- Po-Nien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20080096321
- Publication date Apr 24, 2008
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS