Yueh-Ying Tsai

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating carrier-free semiconductor package
- Patent number 11,289,409
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-free semiconductor package and fabrication method
- Patent number 10,566,271
- Issue date Feb 18, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package with heat dissipating...
- Patent number 9,257,311
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Shih-Yao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package without chip carrier
- Patent number 9,190,296
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 9,029,203
- Issue date May 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package without chip carrier and fabrication method t...
- Patent number 8,975,734
- Issue date Mar 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,525,336
- Issue date Sep 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,509,636
- Issue date Jan 21, 2003
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe of quad flat non-leaded package
- Patent number 6,424,024
- Issue date Jul 23, 2002
- Siliconware Precision Industries Co., Ltd.
- Bor Shiun Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20200144167
- Publication date May 7, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
- Publication number 20170200671
- Publication date Jul 13, 2017
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER
- Publication number 20140315351
- Publication date Oct 23, 2014
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...
- Publication number 20140239475
- Publication date Aug 28, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20140134805
- Publication date May 15, 2014
- Siliconware Precision Industries Co., Ltd.
- Shih-Yao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20130344661
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130093086
- Publication date Apr 18, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130009311
- Publication date Jan 10, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...
- Publication number 20120007234
- Publication date Jan 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
- Publication number 20110298126
- Publication date Dec 8, 2011
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Yueh-Ying Tsai

Person

Patents Grantslast 30 patents

Method for fabricating carrier-free semiconductor package

Carrier-free semiconductor package and fabrication method

Method of fabricating a semiconductor package with heat dissipating...

Fabrication method of semiconductor package without chip carrier

Method of fabricating semiconductor package

Semiconductor package without chip carrier and fabrication method t...

Semiconductor package and method of fabricating the same

Semiconductor package

Leadframe of quad flat non-leaded package

Patents Applicationslast 30 patents

METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD