Yueli Liu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,103,103
- Issue date Oct 16, 2018
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 9,640,485
- Issue date May 2, 2017
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless substrate with passive device pads
- Patent number 9,502,336
- Issue date Nov 22, 2016
- Intel Corporation
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded insulator in package assembly
- Patent number 9,412,625
- Issue date Aug 9, 2016
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,355,952
- Issue date May 31, 2016
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 9,147,663
- Issue date Sep 29, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for embedded bridge
- Patent number 9,147,638
- Issue date Sep 29, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded insulator in package assembly
- Patent number 9,113,573
- Issue date Aug 18, 2015
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,093,313
- Issue date Jul 28, 2015
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 8,835,217
- Issue date Sep 16, 2014
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20240014138
- Publication date Jan 11, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20210384129
- Publication date Dec 9, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20200043852
- Publication date Feb 6, 2020
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20190013271
- Publication date Jan 10, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20170207168
- Publication date Jul 20, 2017
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INSULATOR IN PACKAGE ASSEMBLY
- Publication number 20160336258
- Publication date Nov 17, 2016
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20150364423
- Publication date Dec 17, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INSULATOR IN PACKAGE ASSEMBLY
- Publication number 20150318191
- Publication date Nov 5, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150318238
- Publication date Nov 5, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR EMBEDDED BRIDGE
- Publication number 20150028486
- Publication date Jan 29, 2015
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY CONFIGURATIONS FOR MULTIPLE DIES AND ASSOCIATED TE...
- Publication number 20150014852
- Publication date Jan 15, 2015
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150008578
- Publication date Jan 8, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20140353827
- Publication date Dec 4, 2014
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE WITH PASSIVE DEVICE PADS
- Publication number 20140268612
- Publication date Sep 18, 2014
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INSULATOR IN PACKAGE ASSEMBLY
- Publication number 20140138825
- Publication date May 22, 2014
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20120161330
- Publication date Jun 28, 2012
- Intel Corporation
- Mark S. Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Coreless substrate with passive device pads

Molded insulator in package assembly

Device packaging with substrates having embedded lines and metal de...

Bridge interconnection with layered interconnect structures

Interconnect structures for embedded bridge

Molded insulator in package assembly

Device packaging with substrates having embedded lines and metal de...

Device packaging with substrates having embedded lines and metal de...

Patents Applicationslast 30 patents

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

MOLDED INSULATOR IN PACKAGE ASSEMBLY

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

MOLDED INSULATOR IN PACKAGE ASSEMBLY

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

INTERCONNECT STRUCTURES FOR EMBEDDED BRIDGE

PACKAGE ASSEMBLY CONFIGURATIONS FOR MULTIPLE DIES AND ASSOCIATED TE...

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

CORELESS SUBSTRATE WITH PASSIVE DEVICE PADS

MOLDED INSULATOR IN PACKAGE ASSEMBLY

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...