Yuelin ZHAO

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,837,287
- Issue date Dec 5, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEALING STRUCTURE FOR A BONDED WAFER AND METHOD OF FORMING THE SEAL...
- Publication number 20170213746
- Publication date Jul 27, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING STRUCTURE FOR A BONDED WAFER AND METHOD OF FORMING THE SEAL...
- Publication number 20150235918
- Publication date Aug 20, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun HOU
- H01 - BASIC ELECTRIC ELEMENTS