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last 30 patents
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Patent Grant
Method and system for predicting high-temperature operating life of...
Patent number
10,041,994
Issue date
Aug 7, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
Wei-Ting Chien
G01 - MEASURING TESTING
Patents Applications
last 30 patents
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Patent Application
Bottom Layer Metal Interconnection Line Structure
Publication number
20240282701
Publication date
Aug 22, 2024
Shanghai Huali Integrated Circuit Corporation
Yekai Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR ENHANCING SIGNAL INTENSITY OF RADIO FREQUE...
Publication number
20210005442
Publication date
Jan 7, 2021
SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES
Rong QIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND SYSTEM FOR PREDICTING HIGH-TEMPERATURE OPERATING LIFE OF...
Publication number
20170285099
Publication date
Oct 5, 2017
Semiconductor Manufacturing International (Shanghai) Corporation
Wei-Ting CHIEN
G01 - MEASURING TESTING