Yufei HU

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of selective deposition
- Patent number 12,157,943
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature plasma pre-clean for selective gap fill
- Patent number 11,955,381
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber matching and calibration
- Patent number 11,749,543
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Xuesong Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual plasma pre-clean for selective gap fill
- Patent number 11,721,542
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Yi Xu
- B08 - CLEANING
Information Patent Grant
Directional selective junction clean with field polymer protections
- Patent number 11,562,909
- Issue date Jan 24, 2023
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition within trench structures
- Patent number 11,515,200
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,404,313
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming cobalt and ruthenium capping layers for interco...
- Patent number 11,171,046
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC CARRIER HEAD MONITORING
- Publication number 20240139900
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES
- Publication number 20220367264
- Publication date Nov 17, 2022
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS
- Publication number 20220336223
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL
- Publication number 20220319837
- Publication date Oct 6, 2022
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TUNGSTEN DEPOSITION WITHIN TRENCH STRUCTURES
- Publication number 20220181201
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVE DEPOSITION
- Publication number 20220064784
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER MATCHING AND CALIBRATION
- Publication number 20220005713
- Publication date Jan 6, 2022
- Applied Materials, Inc.
- Xuesong Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW-TEMPERATURE PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL
- Publication number 20210398850
- Publication date Dec 23, 2021
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS
- Publication number 20210366722
- Publication date Nov 25, 2021
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL
- Publication number 20210159070
- Publication date May 27, 2021
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20210062330
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- Wenjing XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES
- Publication number 20200335395
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COBALT AND RUTHENIUM CAPPING LAYERS FOR INTERCO...
- Publication number 20200321247
- Publication date Oct 8, 2020
- Applied Materials, Inc.
- FENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CAPPING PROTECTION FOR AN INTERCONNECTION STRUC...
- Publication number 20190148150
- Publication date May 16, 2019
- Applied Materials, Inc.
- Joung Joo LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods of selective deposition

Selective tungsten deposition at low temperatures

Low-temperature plasma pre-clean for selective gap fill

Chamber matching and calibration

Dual plasma pre-clean for selective gap fill

Directional selective junction clean with field polymer protections

Selective tungsten deposition within trench structures

Selective tungsten deposition at low temperatures

Methods for forming cobalt and ruthenium capping layers for interco...

Patents Applicationslast 30 patents

ACOUSTIC CARRIER HEAD MONITORING

SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES

DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS

DUAL PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL

SELECTIVE TUNGSTEN DEPOSITION WITHIN TRENCH STRUCTURES

METHODS OF SELECTIVE DEPOSITION

CHAMBER MATCHING AND CALIBRATION

LOW-TEMPERATURE PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL

DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS

DUAL PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES

METHODS FOR FORMING COBALT AND RUTHENIUM CAPPING LAYERS FOR INTERCO...

METHODS FOR FORMING CAPPING PROTECTION FOR AN INTERCONNECTION STRUC...