Yuh Chern SHIEH

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a conductive via structure
- Patent number 10,157,831
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having a conductive via stru...
- Patent number 9,514,978
- Issue date Dec 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 9,406,634
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via structure
- Patent number 9,159,638
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace (BOT) structures
- Patent number 9,041,223
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extending metal traces in bump-on-trace structures
- Patent number 8,970,033
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for controlling package warpage
- Patent number 8,519,535
- Issue date Aug 27, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-stress bump-on-trace (BOT) structures
- Patent number 8,288,871
- Issue date Oct 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining registration areas in a wireless communicati...
- Patent number 7,477,895
- Issue date Jan 13, 2009
- Groundhog Technologies Inc.
- Meng-Seng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIA STRUCTURE
- Publication number 20170062329
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIA STRU...
- Publication number 20160005645
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20150243622
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern SHIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-ON-TRACE (BOT) STRUCTURES
- Publication number 20130001778
- Publication date Jan 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern SHIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA STRUCTURE
- Publication number 20120299161
- Publication date Nov 29, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CONTROLLING PACKAGE WARPAGE
- Publication number 20120286417
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-STRESS BUMP-ON-TRACE (BOT) STRUCTURES
- Publication number 20120273934
- Publication date Nov 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern SHIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extending Metal Traces in Bump-on-Trace Structures
- Publication number 20120217632
- Publication date Aug 30, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partitioning method for mobile communication network with overlappi...
- Publication number 20060009237
- Publication date Jan 12, 2006
- Groundhog Technologies Inc.
- Meng-Seng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Partitioning method for mobile communication network
- Publication number 20060009207
- Publication date Jan 12, 2006
- Groundhog Technologies Inc.
- Meng-Seng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for determining registration areas in a wireless communicati...
- Publication number 20050159155
- Publication date Jul 21, 2005
- Meng-Seng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yuh Chern SHIEH

Person

Patents Grantslast 30 patents

Semiconductor device having a conductive via structure

Method of forming semiconductor device having a conductive via stru...

Package structure and method of forming the same

Conductive via structure

Bump-on-trace (BOT) structures

Extending metal traces in bump-on-trace structures

Method and structure for controlling package warpage

Reduced-stress bump-on-trace (BOT) structures

Method for determining registration areas in a wireless communicati...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIA STRUCTURE

METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIA STRU...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

BUMP-ON-TRACE (BOT) STRUCTURES

CONDUCTIVE VIA STRUCTURE

METHOD AND STRUCTURE FOR CONTROLLING PACKAGE WARPAGE

REDUCED-STRESS BUMP-ON-TRACE (BOT) STRUCTURES

Extending Metal Traces in Bump-on-Trace Structures

Partitioning method for mobile communication network with overlappi...

Partitioning method for mobile communication network

Method for determining registration areas in a wireless communicati...