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Taipei Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit die pad cavity
Patent number
11,942,448
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Bo-Hsun Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die mounted in a recess of die pad
Patent number
11,862,538
Issue date
Jan 2, 2024
Texas Instruments Incorporated
Chung-Hao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with exposed tie bar
Patent number
11,817,374
Issue date
Nov 14, 2023
Texas Instruments Incorporated
Chih-Chien Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Exposed heat-generating devices
Patent number
11,742,265
Issue date
Aug 29, 2023
Texas Instruments Incorporated
Hung-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages with multiple exposed pads
Patent number
11,735,506
Issue date
Aug 22, 2023
Texas Instruments Incorporated
Hung-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leads for semiconductor package
Patent number
11,538,740
Issue date
Dec 27, 2022
Texas Instruments Incorporated
Jason Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged electronic device with split die pad in robust package sub...
Patent number
11,444,012
Issue date
Sep 13, 2022
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Finger pad leadframe
Patent number
11,081,429
Issue date
Aug 3, 2021
Texas Instruments Incorporated
Jason Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with three dimensional thermal pad
Patent number
11,081,428
Issue date
Aug 3, 2021
Texas Instruments Incorporated
Stanley Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Angled die pad of a leadframe for a molded integrated circuit package
Patent number
10,957,631
Issue date
Mar 23, 2021
Texas Instruments Incorporated
Chung-Ming Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
Patent number
10,861,777
Issue date
Dec 8, 2020
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a wire support leadframe for a semiconductor device
Patent number
10,811,343
Issue date
Oct 20, 2020
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe
Patent number
10,573,581
Issue date
Feb 25, 2020
Texas Instruments Incorporated
Chih-Chien Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire support for a leadframe
Patent number
10,529,654
Issue date
Jan 7, 2020
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanical couplings designed to resolve process constraints
Patent number
10,340,152
Issue date
Jul 2, 2019
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a wire support leadframe for a semiconductor device
Patent number
10,229,868
Issue date
Mar 12, 2019
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire support for a leadframe
Patent number
10,121,733
Issue date
Nov 6, 2018
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a wire support leadframe for a semiconductor device
Patent number
9,627,331
Issue date
Apr 18, 2017
Texas Instruments Incorporated
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
Publication number
20230395472
Publication date
Dec 7, 2023
TEXAS INSTRUMENTS INCORPORATED
Hung-Yu CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
Publication number
20230317571
Publication date
Oct 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Hsiang Ming Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PAD RECESSES
Publication number
20230063262
Publication date
Mar 2, 2023
TEXAS INSTRUMENTS INCORPORATED
Chung-Hao LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
Publication number
20230016577
Publication date
Jan 19, 2023
TEXAS INSTRUMENTS INCORPORATED
Bo-Hsun Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH EXPOSED TIE BAR
Publication number
20220336331
Publication date
Oct 20, 2022
TEXAS INSTRUMENTS INCORPORATED
Chih-Chien Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
Publication number
20210375640
Publication date
Dec 2, 2021
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED ELECTRONIC DEVICE WITH SPLIT DIE PAD IN ROBUST PACKAGE SUB...
Publication number
20210305139
Publication date
Sep 30, 2021
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXPOSED HEAT-GENERATING DEVICES
Publication number
20210118779
Publication date
Apr 22, 2021
TEXAS INSTRUMENTS INCORPORATED
Hung-Yu CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGER PAD LEADFRAME
Publication number
20210111103
Publication date
Apr 15, 2021
TEXAS INSTRUMENTS INCORPORATED
Jason CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
Publication number
20210043548
Publication date
Feb 11, 2021
TEXAS INSTRUMENTS INCORPORATED
Stanley Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADS FOR SEMICONDUCTOR PACKAGE
Publication number
20210020549
Publication date
Jan 21, 2021
TEXAS INSTRUMENTS INCORPORATED
Jason CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANGLED DIE PAD OF A LEADFRAME FOR A MOLDED INTEGRATED CIRCUIT PACKAGE
Publication number
20200194345
Publication date
Jun 18, 2020
TEXAS INSTRUMENTS INCORPORATED
Chung-Ming CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
Publication number
20190355652
Publication date
Nov 21, 2019
TEXAS INSTRUMENTS INCORPORATED
Hung-Yu CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
Publication number
20190326131
Publication date
Oct 24, 2019
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
Publication number
20190206699
Publication date
Jul 4, 2019
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
Publication number
20190206769
Publication date
Jul 4, 2019
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
Publication number
20190172776
Publication date
Jun 6, 2019
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire Support For A Leadframe
Publication number
20190027429
Publication date
Jan 24, 2019
TEXAS INSTRUMENTS INCORPORATED
YUH-HARNG CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
Publication number
20180174950
Publication date
Jun 21, 2018
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME
Publication number
20180090419
Publication date
Mar 29, 2018
TEXAS INSTRUMENTS INCORPORATED
Chih-Chien Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire Support for a Leadframe
Publication number
20170194236
Publication date
Jul 6, 2017
TEXAS INSTRUMENTS INCORPORATED
Yuh-Harng Chien
H01 - BASIC ELECTRIC ELEMENTS