Yuh-Harng Chien

Person

Taipei Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die pad cavity
- Patent number 11,942,448
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mounted in a recess of die pad
- Patent number 11,862,538
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Chung-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with exposed tie bar
- Patent number 11,817,374
- Issue date Nov 14, 2023
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed heat-generating devices
- Patent number 11,742,265
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple exposed pads
- Patent number 11,735,506
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for semiconductor package
- Patent number 11,538,740
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Jason Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with split die pad in robust package sub...
- Patent number 11,444,012
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finger pad leadframe
- Patent number 11,081,429
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Jason Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with three dimensional thermal pad
- Patent number 11,081,428
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled die pad of a leadframe for a molded integrated circuit package
- Patent number 10,957,631
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Chung-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,811,343
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe
- Patent number 10,573,581
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,529,654
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 10,340,152
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,229,868
- Issue date Mar 12, 2019
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,121,733
- Issue date Nov 6, 2018
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 9,627,331
- Issue date Apr 18, 2017
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH LEAD LOCK
- Publication number 20250038077
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- CHU-YUN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20240274569
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20230395472
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
- Publication number 20230317571
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hsiang Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PAD RECESSES
- Publication number 20230063262
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Chung-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20230016577
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH EXPOSED TIE BAR
- Publication number 20220336331
- Publication date Oct 20, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20210375640
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH SPLIT DIE PAD IN ROBUST PACKAGE SUB...
- Publication number 20210305139
- Publication date Sep 30, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED HEAT-GENERATING DEVICES
- Publication number 20210118779
- Publication date Apr 22, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGER PAD LEADFRAME
- Publication number 20210111103
- Publication date Apr 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jason CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
- Publication number 20210043548
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADS FOR SEMICONDUCTOR PACKAGE
- Publication number 20210020549
- Publication date Jan 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jason CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE PAD OF A LEADFRAME FOR A MOLDED INTEGRATED CIRCUIT PACKAGE
- Publication number 20200194345
- Publication date Jun 18, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Chung-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20190355652
- Publication date Nov 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20190326131
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20190206699
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
- Publication number 20190206769
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20190172776
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Support For A Leadframe
- Publication number 20190027429
- Publication date Jan 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- YUH-HARNG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20180174950
- Publication date Jun 21, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20180090419
- Publication date Mar 29, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Support for a Leadframe
- Publication number 20170194236
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS

Yuh-Harng Chien

Person

Patents Grantslast 30 patents

Mechanical couplings designed to resolve process constraints

Integrated circuit die pad cavity

Semiconductor die mounted in a recess of die pad

Electronic device with exposed tie bar

Exposed heat-generating devices

Packages with multiple exposed pads

Leads for semiconductor package

Packaged electronic device with split die pad in robust package sub...

Finger pad leadframe

Electronic device with three dimensional thermal pad

Angled die pad of a leadframe for a molded integrated circuit package

Wire bond clamp design and lead frame capable of engaging with same

Method of making a wire support leadframe for a semiconductor device

Leadframe

Wire support for a leadframe

Mechanical couplings designed to resolve process constraints

Method of making a wire support leadframe for a semiconductor device

Wire support for a leadframe

Method of making a wire support leadframe for a semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH LEAD LOCK

INTEGRATED CIRCUIT DIE PAD CAVITY

PACKAGES WITH MULTIPLE EXPOSED PADS

LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE

DIE PAD RECESSES

INTEGRATED CIRCUIT DIE PAD CAVITY

ELECTRONIC DEVICE WITH EXPOSED TIE BAR

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

PACKAGED ELECTRONIC DEVICE WITH SPLIT DIE PAD IN ROBUST PACKAGE SUB...

EXPOSED HEAT-GENERATING DEVICES

FINGER PAD LEADFRAME

ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD

LEADS FOR SEMICONDUCTOR PACKAGE

ANGLED DIE PAD OF A LEADFRAME FOR A MOLDED INTEGRATED CIRCUIT PACKAGE

PACKAGES WITH MULTIPLE EXPOSED PADS

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

Method Of Making A Wire Support Leadframe For A Semiconductor Device

Wire Support For A Leadframe

Method Of Making A Wire Support Leadframe For A Semiconductor Device

LEADFRAME

Wire Support for a Leadframe