-
Tool and method of reflow
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Patent number 11,000,923
-
Issue date May 11, 2021
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Taiwan Semiconductor Manufacturing Co., Ltd
-
Shih-Yen Chen
-
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Bonding apparatus and method
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Patent number 10,312,118
-
Issue date Jun 4, 2019
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Taiwan Semiconductor Manufacturing Co., Ltd
-
Pei-Shan Wu
-
H01 - BASIC ELECTRIC ELEMENTS
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Tool and method of reflow
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Patent number 9,808,891
-
Issue date Nov 7, 2017
-
Taiwan Semiconductor Manufacturing Co., Ltd
-
Shih-Yen Chen
-
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
-
Device and method for wafer taping
-
Patent number 9,761,468
-
Issue date Sep 12, 2017
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Yuh-Sen Chang
-
H01 - BASIC ELECTRIC ELEMENTS
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-
-
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Method for planarization
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Patent number 7,838,427
-
Issue date Nov 23, 2010
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Yuh-Hwa Chang
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
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Backside coating for MEMS wafer
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Patent number 7,153,768
-
Issue date Dec 26, 2006
-
Taiwan Semiconductor Manufacturing Co.
-
Fei-Yuh Chen
-
B81 - MICRO-STRUCTURAL TECHNOLOGY
-
-
Micromirror for MEMS device
-
Patent number 7,057,794
-
Issue date Jun 6, 2006
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Shen-Ping Wang
-
G02 - OPTICS
-
-
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-