TREA

Yuhei FUJII

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Expanding apparatus
    • Patent number 12,255,087
    • Issue date Mar 18, 2025
    • Disco Corporation
    • Tomohito Matsuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer dividing apparatus
    • Patent number 11,254,029
    • Issue date Feb 22, 2022
    • Disco Corporation
    • Takayuki Masada
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    HOLDING UNIT
    • Publication number 20230339055
    • Publication date Oct 26, 2023
    • Disco Corporation
    • Takayuki MASADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EXPANDING APPARATUS
    • Publication number 20230170246
    • Publication date Jun 1, 2023
    • Disco Corporation
    • Tomohito Matsuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DIVIDING APPARATUS
    • Publication number 20200171707
    • Publication date Jun 4, 2020
    • Disco Corporation
    • Takayuki MASADA
    • B28 - WORKING CEMENT, CLAY, OR STONE