Yuhei HORIKAWA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 11,869,834
- Issue date Jan 9, 2024
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sheet material, metal mesh, wiring substrate, display device and ma...
- Patent number 11,668,008
- Issue date Jun 6, 2023
- TDK Corporation
- Makoto Orikasa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sheet material, metal mesh and manufacturing methods thereof
- Patent number 11,466,368
- Issue date Oct 11, 2022
- TDK Corporation
- Makoto Orikasa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing electroconductive substrate, electronic device...
- Patent number 11,410,855
- Issue date Aug 9, 2022
- TDK Corporation
- Takashi Daitoku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 11,031,330
- Issue date Jun 8, 2021
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sheet material, metal mesh, wiring substrate, display device and ma...
- Patent number 10,968,519
- Issue date Apr 6, 2021
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 10,867,898
- Issue date Dec 15, 2020
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of producing electroconductive substrate, electronic device...
- Patent number 10,784,122
- Issue date Sep 22, 2020
- TDK Corporation
- Takashi Daitoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating electronic component
- Patent number 10,392,704
- Issue date Aug 27, 2019
- TDK Corporation
- Kenichi Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring component
- Patent number 10,374,301
- Issue date Aug 6, 2019
- TDK Corporation
- Yuhei Horikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing planar coil
- Patent number 10,354,796
- Issue date Jul 16, 2019
- TDK Corporation
- Yuhei Horikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module having a protective film comprising a p...
- Patent number 10,304,779
- Issue date May 28, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction structure for an electronic device and electronic device
- Patent number 10,205,250
- Issue date Feb 12, 2019
- TDK Corporation
- Kenichi Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 9,818,736
- Issue date Nov 14, 2017
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure and semiconductor device
- Patent number 9,640,500
- Issue date May 2, 2017
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, and semiconductor element and module substrate...
- Patent number 9,257,402
- Issue date Feb 9, 2016
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, and semiconductor element and module substrate...
- Patent number 9,224,706
- Issue date Dec 29, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating and electronic component
- Patent number 9,177,687
- Issue date Nov 3, 2015
- TDK Corporation
- Kenichi Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal structure and semiconductor device
- Patent number 9,070,606
- Issue date Jun 30, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency transmission line, antenna, and electronic circuit b...
- Patent number 8,976,076
- Issue date Mar 10, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, and semiconductor element and module substrate...
- Patent number 8,970,037
- Issue date Mar 3, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating and electronic component
- Patent number 8,933,336
- Issue date Jan 13, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, printed wiring board, module substrate, and ele...
- Patent number 8,816,213
- Issue date Aug 26, 2014
- TDK Corporation
- Yuhei Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure, printed circuit board, module board, electronic...
- Patent number 8,787,028
- Issue date Jul 22, 2014
- TDK Corporation
- Yuhei Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure, printed wiring board, module substrate, and ele...
- Patent number 8,692,127
- Issue date Apr 8, 2014
- TDK Corporation
- Yuhei Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER BODY, NEGATIVE ELECTRODE COLLECTOR FOR LITHIUM ION SECON...
- Publication number 20240072239
- Publication date Feb 29, 2024
- TDK Corporation
- Yuhei HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BODY, NEGATIVE ELECTRODE CURRENT COLLECTOR FOR LITHIUM ION...
- Publication number 20240047694
- Publication date Feb 8, 2024
- TDK Corporation
- Yuhei HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BODY, NEGATIVE ELECTRODE CURRENT COLLECTOR FOR LITHIUM ION...
- Publication number 20240047695
- Publication date Feb 8, 2024
- TDK Corporation
- Yuhei HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE
- Publication number 20210265256
- Publication date Aug 26, 2021
- TDK Corporation
- Takashi DAITOKU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MA...
- Publication number 20210087692
- Publication date Mar 25, 2021
- TDK Corporation
- Makoto ORIKASA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF PRODUCING ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE...
- Publication number 20200381266
- Publication date Dec 3, 2020
- TDK Corporation
- Takashi DAITOKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE
- Publication number 20200211951
- Publication date Jul 2, 2020
- TDK Corporation
- Takashi DAITOKU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF PRODUCING ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE...
- Publication number 20190043736
- Publication date Feb 7, 2019
- TDK Corporation
- Takashi DAITOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET MATERIAL, METAL MESH AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20190032221
- Publication date Jan 31, 2019
- TDK Corporation
- Makoto ORIKASA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE
- Publication number 20190035719
- Publication date Jan 31, 2019
- TDK Corporation
- Takashi DAITOKU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MA...
- Publication number 20190032219
- Publication date Jan 31, 2019
- TDK Corporation
- Makoto ORIKASA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING COMPONENT
- Publication number 20180175494
- Publication date Jun 21, 2018
- TDK Corporation
- Yuhei Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PLANAR COIL
- Publication number 20180174748
- Publication date Jun 21, 2018
- TDK Corporation
- Yuhei Horikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180114759
- Publication date Apr 26, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING AND ELECTRONIC COMPONENT
- Publication number 20170130337
- Publication date May 11, 2017
- TDK Corporation
- Kenichi YOSHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140291021
- Publication date Oct 2, 2014
- TDK Corporation
- Kenichi YOSHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...
- Publication number 20140054770
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20140054767
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20140054768
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...
- Publication number 20140054769
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY TRANSMISSION LINE, ANTENNA, AND ELECTRONIC CIRCUIT B...
- Publication number 20130257682
- Publication date Oct 3, 2013
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD IN...
- Publication number 20130192873
- Publication date Aug 1, 2013
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, PRINTED CIRCUIT BOARD, MODULE BOARD, ELECTRONIC...
- Publication number 20130135834
- Publication date May 30, 2013
- TDK Corporation
- Yuhei Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING AND ELECTRONIC COMPONENT
- Publication number 20130130059
- Publication date May 23, 2013
- TDK Corporation
- Kenichi YOSHIDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COATING AND ELECTRONIC COMPONENT
- Publication number 20130126208
- Publication date May 23, 2013
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELE...
- Publication number 20120044651
- Publication date Feb 23, 2012
- TDK Corporation
- Yuhei HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELE...
- Publication number 20120044652
- Publication date Feb 23, 2012
- TDK Corporation
- Yuhei HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING AND ELECTRONIC COMPONENT
- Publication number 20120018191
- Publication date Jan 26, 2012
- TDK Corporation
- Kenichi YOSHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yuhei HORIKAWA

Person

Patents Grantslast 30 patents

Electroconductive substrate, electronic device and display device

Sheet material, metal mesh, wiring substrate, display device and ma...

Sheet material, metal mesh and manufacturing methods thereof

Method of producing electroconductive substrate, electronic device...

Electroconductive substrate, electronic device and display device

Sheet material, metal mesh, wiring substrate, display device and ma...

Electroconductive substrate, electronic device and display device

Method of producing electroconductive substrate, electronic device...

Coating electronic component

Wiring component

Method for manufacturing planar coil

Method for producing semiconductor chip

Electronic component module having a protective film comprising a p...

Junction structure for an electronic device and electronic device

Method for producing semiconductor package

Method for producing semiconductor package

Terminal structure and semiconductor device

Terminal structure, and semiconductor element and module substrate...

Terminal structure, and semiconductor element and module substrate...

Coating and electronic component

Terminal structure and semiconductor device

High-frequency transmission line, antenna, and electronic circuit b...

Terminal structure, and semiconductor element and module substrate...

Coating and electronic component

Terminal structure, printed wiring board, module substrate, and ele...

Terminal structure, printed circuit board, module board, electronic...

Terminal structure, printed wiring board, module substrate, and ele...

Patents Applicationslast 30 patents

MULTILAYER BODY, NEGATIVE ELECTRODE COLLECTOR FOR LITHIUM ION SECON...

LAYERED BODY, NEGATIVE ELECTRODE CURRENT COLLECTOR FOR LITHIUM ION...

LAYERED BODY, NEGATIVE ELECTRODE CURRENT COLLECTOR FOR LITHIUM ION...

ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE

SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MA...

METHOD OF PRODUCING ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE...

ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE

METHOD OF PRODUCING ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE...

SHEET MATERIAL, METAL MESH AND METHOD FOR MANUFACTURING THEREOF

ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE

SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MA...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

WIRING COMPONENT

METHOD FOR MANUFACTURING PLANAR COIL

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

COATING AND ELECTRONIC COMPONENT

JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE

TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...

TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE

TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE

TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...

HIGH-FREQUENCY TRANSMISSION LINE, ANTENNA, AND ELECTRONIC CIRCUIT B...

STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD IN...

TERMINAL STRUCTURE, PRINTED CIRCUIT BOARD, MODULE BOARD, ELECTRONIC...

COATING AND ELECTRONIC COMPONENT

COATING AND ELECTRONIC COMPONENT

TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELE...

TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELE...

COATING AND ELECTRONIC COMPONENT