YuhHarng Chien

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package substrate with a smooth groove about a perime...
- Patent number 11,791,289
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package substrate with a smooth groove about a perime...
- Patent number 11,302,652
- Issue date Apr 12, 2022
- Texas Instruments Incorporated
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe with die pad having cantilevers to secure electronic comp...
- Patent number 10,910,293
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- ChienHao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20240047381
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20220246545
- Publication date Aug 4, 2022
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20210193590
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING