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Yuhong Joann Cai
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Folsom, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die over mold stacked semiconductor package
Patent number
11,948,917
Issue date
Apr 2, 2024
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual head capillary design for vertical wire bond
Patent number
11,894,334
Issue date
Feb 6, 2024
Intel Corporation
Yuhong Cai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad design for thermal fatigue resistance and interconnect joint re...
Patent number
11,848,292
Issue date
Dec 19, 2023
Intel Corporation
Sireesha Gogineni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bowl shaped pad
Patent number
11,694,976
Issue date
Jul 4, 2023
Intel Corporation
Yuhong Cai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package design for solder joint reliability
Patent number
11,569,144
Issue date
Jan 31, 2023
Intel Corporation
Yuhong Cai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder mask design for delamination prevention
Patent number
11,476,174
Issue date
Oct 18, 2022
Intel Corporation
James Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack with cascade and vertical connections
Patent number
11,171,114
Issue date
Nov 9, 2021
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with thermal fins
Patent number
10,573,575
Issue date
Feb 25, 2020
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball pad with a plurality of lobes
Patent number
10,192,840
Issue date
Jan 29, 2019
Intel Corporation
Yuhong Cai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Local stress-relieving devices, systems, and methods for electronic...
Patent number
10,051,763
Issue date
Aug 14, 2018
Intel Corporation
Yuhong Cai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20220037291
Publication date
Feb 3, 2022
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE OVER MOLD STACKED SEMICONDUCTOR PACKAGE
Publication number
20200343221
Publication date
Oct 29, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHOKED FLOW COOLING
Publication number
20200135616
Publication date
Apr 30, 2020
Intel Corporation
Mark FORSNES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER MASK DESIGN FOR DELAMINATION PREVENTION
Publication number
20200135602
Publication date
Apr 30, 2020
Intel Corporation
James ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL HEAD CAPILLARY DESIGN FOR VERTICAL WIRE BOND
Publication number
20200118961
Publication date
Apr 16, 2020
Intel Corporation
Yuhong CAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DESIGN FOR SOLDER JOINT RELIABILITY
Publication number
20200118901
Publication date
Apr 16, 2020
Intel Corporation
Yuhong CAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOWL SHAPED PAD
Publication number
20200118954
Publication date
Apr 16, 2020
Intel Corporation
Yuhong CAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD DESIGN FOR THERMAL FATIGUE RESISTANCE AND INTERCONNECT JOINT RE...
Publication number
20200118955
Publication date
Apr 16, 2020
Intel Corporation
Sireesha GOGINENI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL FINS
Publication number
20190067156
Publication date
Feb 28, 2019
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRESS DISTRIBUTION INTERPOSER FOR MITIGATING SUBSTRATE CRACKING
Publication number
20190035720
Publication date
Jan 31, 2019
Intel Corporation
Min-Tih LAI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20180366441
Publication date
Dec 20, 2018
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOCAL STRESS-RELIEVING DEVICES, SYSTEMS, AND METHODS FOR ELECTRONIC...
Publication number
20180098421
Publication date
Apr 5, 2018
Intel Corporation
Yuhong Cai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CRACK RESISTANT ELECTRONIC DEVICE PACKAGE SUBSTRATES
Publication number
20170186701
Publication date
Jun 29, 2017
Intel Corporation
Yuhong Cai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL PAD WITH A PLURALITY OF LOBES
Publication number
20170092608
Publication date
Mar 30, 2017
Yuhong Joann Cai
H01 - BASIC ELECTRIC ELEMENTS