Yuichi Kakizono

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fixed abrasive-grain processing device, method of fixed abrasive-gr...
- Patent number 9,550,264
- Issue date Jan 24, 2017
- Sumco Corporation
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing solution distribution apparatus and polishing apparatus h...
- Patent number 9,017,145
- Issue date Apr 28, 2015
- Sumco Corporation
- Yoshiaki Kurosawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of grinding semiconductor wafers, grinding surface plate, an...
- Patent number 8,092,277
- Issue date Jan 10, 2012
- Sumco Corporation
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Grant
Etching liquid for controlling silicon wafer surface shape and meth...
- Patent number 7,288,207
- Issue date Oct 30, 2007
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
- Publication number 20120315739
- Publication date Dec 13, 2012
- SUMCO CORPORATION
- Tomohiro Hashii
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
FIXED ABRASIVE-GRAIN PROCESSING DEVICE, METHOD OF FIXED ABRASIVE-GR...
- Publication number 20120071064
- Publication date Mar 22, 2012
- SUMCO CORPORATION
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SOLUTION DISTRIBUTION APPARATUS AND POLISHING APPARATUS H...
- Publication number 20110263183
- Publication date Oct 27, 2011
- SUMCO CORPORATION
- Yoshiaki KUROSAWA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
- Publication number 20090311808
- Publication date Dec 17, 2009
- SUMCO CORPORATION
- Tomohiro Hashii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
- Publication number 20090311948
- Publication date Dec 17, 2009
- SUMCO CORPORATION
- Tomohiro Hashii
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
- Publication number 20090311863
- Publication date Dec 17, 2009
- SUMCO CORPORATION
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
- Publication number 20090311949
- Publication date Dec 17, 2009
- SUMCO CORPORATION
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AN...
- Publication number 20090298396
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Tomohiro HASHII
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOT...
- Publication number 20090298397
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Yasunori YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
Etching Liquid for Controlling Silicon Wafer Surface Shape
- Publication number 20070184658
- Publication date Aug 9, 2007
- Sakae Koyata
- C30 - CRYSTAL GROWTH
Information Patent Application
Etching liquid for controlling silicon wafer surface shape and meth...
- Publication number 20060169667
- Publication date Aug 3, 2006
- Sakae Koyata
- C30 - CRYSTAL GROWTH

Yuichi Kakizono

Person

Patents Grantslast 30 patents

Fixed abrasive-grain processing device, method of fixed abrasive-gr...

Polishing solution distribution apparatus and polishing apparatus h...

Method of grinding semiconductor wafers, grinding surface plate, an...

Etching liquid for controlling silicon wafer surface shape and meth...

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER

FIXED ABRASIVE-GRAIN PROCESSING DEVICE, METHOD OF FIXED ABRASIVE-GR...

POLISHING SOLUTION DISTRIBUTION APPARATUS AND POLISHING APPARATUS H...

METHOD FOR PRODUCING SEMICONDUCTOR WAFER

METHOD FOR PRODUCING SEMICONDUCTOR WAFER

METHOD FOR PRODUCING SEMICONDUCTOR WAFER

METHOD FOR PRODUCING SEMICONDUCTOR WAFER

METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AN...

METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOT...

Etching Liquid for Controlling Silicon Wafer Surface Shape

Etching liquid for controlling silicon wafer surface shape and meth...