Yuichi Kanda

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Patents Grantslast 30 patents

Information Patent Grant
Process for forming metal layers
- Patent number 7,416,763
- Issue date Aug 26, 2008
- Cookson Electronics Co.
- Yuichi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated metallic materials and manufacturing method thereof
- Patent number 6,451,448
- Issue date Sep 17, 2002
- Mitsubishi Shindoh Co. Ltd.
- Yuichi Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lead frame material and lead frame for semiconductor device
- Patent number 5,510,197
- Issue date Apr 23, 1996
- Mitsubishi Shindoh Co., Ltd.
- Shunji Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Process for forming metal layers
- Publication number 20050097735
- Publication date May 12, 2005
- Yuichi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR