Yuichi Matsuda

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Probe card having a wiring substrate
- Patent number 9,488,677
- Issue date Nov 8, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,476,913
- Issue date Oct 25, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,470,718
- Issue date Oct 18, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method for manufacturing probe card
- Patent number 9,459,289
- Issue date Oct 4, 2016
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- G01 - MEASURING TESTING
Information Patent Grant
Joining structure using thermal interface material
- Patent number 9,460,983
- Issue date Oct 4, 2016
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronic device
- Patent number 9,373,587
- Issue date Jun 21, 2016
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,204,544
- Issue date Dec 1, 2015
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method for manufacturing wiring substrate, and se...
- Patent number 9,202,781
- Issue date Dec 1, 2015
- Shinko Electric Industries Co., Ltd.
- Yuko Karasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, its manufacturing method, and semiconductor device
- Patent number 9,006,586
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a core substrate and a semiconductor...
- Patent number 8,664,764
- Issue date Mar 4, 2014
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor containing a large number of filamentous conductors and m...
- Patent number 8,638,542
- Issue date Jan 28, 2014
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,362,369
- Issue date Jan 29, 2013
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor apparatus including the wiring s...
- Patent number 8,324,513
- Issue date Dec 4, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having piercing linear conductors and semiconductor de...
- Patent number 8,242,612
- Issue date Aug 14, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,138,609
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device and method of manuf...
- Patent number 7,763,809
- Issue date Jul 27, 2010
- Shink Electric Industries Co., Inc.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated multilayered substrate having connecting leads for mounti...
- Patent number 6,931,724
- Issue date Aug 23, 2005
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection substrate having metal columns covered by a resin f...
- Patent number 6,828,669
- Issue date Dec 7, 2004
- Shinko Electric Industries Co., Ltd.
- Takahiro Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 6,441,314
- Issue date Aug 27, 2002
- Shinko Electric Industries Co., Inc.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multilayered substrate for semiconductor device
- Patent number 6,418,615
- Issue date Jul 16, 2002
- Shinko Electronics Industries, Co., Ltd.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
- Publication number 20150137849
- Publication date May 21, 2015
- Shinko Electric Industries Co., LTD.
- Michio Horiuchi
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022230
- Publication date Jan 22, 2015
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022229
- Publication date Jan 22, 2015
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140347833
- Publication date Nov 27, 2014
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262465
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140125372
- Publication date May 8, 2014
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...
- Publication number 20140117539
- Publication date May 1, 2014
- Shinko Electric Industries Co., Ltd.
- Yuko KARASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL, METHOD FOR MANUFACTURING THERMAL INTERF...
- Publication number 20130081796
- Publication date Apr 4, 2013
- Shinko Electric Industries Co., LTD.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE MEMBER
- Publication number 20130048350
- Publication date Feb 28, 2013
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120327626
- Publication date Dec 27, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120313245
- Publication date Dec 13, 2012
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR APPARATUS INCLUDING THE WIRING S...
- Publication number 20110175235
- Publication date Jul 21, 2011
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...
- Publication number 20110095419
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...
- Publication number 20110095433
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20110018144
- Publication date Jan 27, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110012266
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110013340
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20100307808
- Publication date Dec 9, 2010
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device and method of manuf...
- Publication number 20050017271
- Publication date Jan 27, 2005
- Shinko Electric Industries Co.,Inc.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20020195272
- Publication date Dec 26, 2002
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered Substrate for Semiconductor Device
- Publication number 20010013425
- Publication date Aug 16, 2001
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection substrate having metal columns covered by a resin f...
- Publication number 20010008309
- Publication date Jul 19, 2001
- Takahiro Iijima
- H01 - BASIC ELECTRIC ELEMENTS

Yuichi Matsuda

Person

Patents Grantslast 30 patents

Probe card having a wiring substrate

Probe card

Probe card

Probe card and method for manufacturing probe card

Joining structure using thermal interface material

Stacked electronic device

Wiring substrate and method of manufacturing the same

Wiring substrate, method for manufacturing wiring substrate, and se...

Wiring substrate, its manufacturing method, and semiconductor device

Semiconductor device including a core substrate and a semiconductor...

Capacitor containing a large number of filamentous conductors and m...

Wiring board

Wiring substrate and semiconductor apparatus including the wiring s...

Wiring board having piercing linear conductors and semiconductor de...

Semiconductor device and method of manufacturing semiconductor device

Multilayered substrate for semiconductor device and method of manuf...

Insulated multilayered substrate having connecting leads for mounti...

Interconnection substrate having metal columns covered by a resin f...

Multilayered substrate for semiconductor device

Method of making multilayered substrate for semiconductor device

Patents Applicationslast 30 patents

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...

THERMAL INTERFACE MATERIAL, METHOD FOR MANUFACTURING THERMAL INTERF...

BASE MEMBER

WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR APPARATUS INCLUDING THE WIRING S...

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...

WIRING BOARD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CAPACITOR AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

Multilayered substrate for semiconductor device and method of manuf...

Multilayered substrate for semiconductor device

Multilayered Substrate for Semiconductor Device

Interconnection substrate having metal columns covered by a resin f...