Yuichi NAKAMURA

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,935,801
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,437,290
- Issue date Sep 6, 2022
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,160,168
- Issue date Oct 26, 2021
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with cavity for built-in electronic component and meth...
- Patent number 9,832,878
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,474,158
- Issue date Oct 18, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,391,044
- Issue date Jul 12, 2016
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component and method for manufac...
- Patent number 9,288,910
- Issue date Mar 15, 2016
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTU...
- Publication number 20220254693
- Publication date Aug 11, 2022
- IBIDEN CO., LTD.
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTU...
- Publication number 20200357712
- Publication date Nov 12, 2020
- IBIDEN CO., LTD.
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTU...
- Publication number 20200359500
- Publication date Nov 12, 2020
- IBIDEN CO., LTD.
- Yusuke TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METH...
- Publication number 20160044789
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFAC...
- Publication number 20150156881
- Publication date Jun 4, 2015
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150034374
- Publication date Feb 5, 2015
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150016079
- Publication date Jan 15, 2015
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PIECE SUBSTRATE
- Publication number 20140146500
- Publication date May 29, 2014
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS

Yuichi NAKAMURA

Person

Patents Grantslast 30 patents

Electronic component built-in wiring board and method for manufactu...

Electronic component built-in wiring board and method for manufactu...

Electronic component built-in wiring board and method for manufactu...

Wiring board with cavity for built-in electronic component and meth...

Printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Substrate with built-in electronic component and method for manufac...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTU...

ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTU...

ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTU...

WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METH...

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFAC...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTI-PIECE SUBSTRATE