Yuichi Nakayoshi

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Nagasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for shape modification of polishing pad
- Patent number 9,073,173
- Issue date Jul 7, 2015
- Sumco Corporation
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing epitaxial silicon wafer
- Patent number 8,728,942
- Issue date May 20, 2014
- Sumico Corporation
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer manufacturing method
- Patent number 8,545,712
- Issue date Oct 1, 2013
- Sumco Techxiv Corporation
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad thickness measuring method and polishing pad thicknes...
- Patent number 8,296,961
- Issue date Oct 30, 2012
- Sumco Corporation
- Yuichi Nakayoshi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING EPITAXIAL SILICON WAFER
- Publication number 20120156878
- Publication date Jun 21, 2012
- SUMCO CORPORATION
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING EPITAXIAL SILICON WAFER
- Publication number 20120149177
- Publication date Jun 14, 2012
- Yuichi Nakayoshi
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR SHAPE MODIFICATION OF POLISHING PAD
- Publication number 20110171885
- Publication date Jul 14, 2011
- SUMCO CORPORATION
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER MANUFACTURING METHOD
- Publication number 20100285665
- Publication date Nov 11, 2010
- SUMCO TECHXIV CORPORATION
- Hiroshi Takai
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD THICKNESS MEASURING METHOD AND POLISHING PAD THICKNES...
- Publication number 20100197197
- Publication date Aug 5, 2010
- SUMCO CORPORATION
- Yuichi NAKAYOSHI
- B24 - GRINDING POLISHING