Yuichi SHIMIZU

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Nishigo-mura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire saw apparatus and method for manufacturing wafer
- Patent number 11,584,037
- Issue date Feb 21, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi Mizushima
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw apparatus
- Patent number 10,589,446
- Issue date Mar 17, 2020
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
WIRE SAW APPARATUS AND METHOD FOR MANUFACTURING WAFER
- Publication number 20210362373
- Publication date Nov 25, 2021
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi MIZUSHIMA
- B24 - GRINDING POLISHING
Information Patent Application
WIRE SAW APPARATUS
- Publication number 20180079108
- Publication date Mar 22, 2018
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE