Yuichi TAGUCHI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bobbin for thermal transfer sheet or image-receiving sheet, assembl...
- Patent number 9,840,094
- Issue date Dec 12, 2017
- Dai Nippon Printing Co., Ltd.
- Shigeta Mori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Printer
- Patent number 9,481,183
- Issue date Nov 1, 2016
- Citizen Holdings Co., Ltd.
- Akira Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic component device, method of manufacturing the same and w...
- Patent number 8,878,357
- Issue date Nov 4, 2014
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printer
- Patent number 8,827,440
- Issue date Sep 9, 2014
- Citizen Holdings Co., Ltd.
- Yutaka Inokuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Package for electronic component, manufacturing method thereof and...
- Patent number 8,564,077
- Issue date Oct 22, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing optical waveguide, optical waveguide and op...
- Patent number 8,532,457
- Issue date Sep 10, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat radiation package and semiconductor device
- Patent number 8,368,206
- Issue date Feb 5, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic component device
- Patent number 8,334,461
- Issue date Dec 18, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 8,304,862
- Issue date Nov 6, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,299,623
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,227,909
- Issue date Jul 24, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method of the semiconductor...
- Patent number 8,212,355
- Issue date Jul 3, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device, and method of manufacturing the same
- Patent number 8,178,957
- Issue date May 15, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having an element mounted on a substrate and a...
- Patent number 8,148,738
- Issue date Apr 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrate for package
- Patent number 8,106,484
- Issue date Jan 31, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting apparatus
- Patent number 8,100,555
- Issue date Jan 24, 2012
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashii
- F21 - LIGHTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,053,886
- Issue date Nov 8, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 8,044,429
- Issue date Oct 25, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate with a wire terminal
- Patent number 8,039,967
- Issue date Oct 18, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printer with recording paper leading edge storage unit
- Patent number 8,029,202
- Issue date Oct 4, 2011
- Citizen Holdings Co., Ltd
- Akira Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Silicon substrate for package
- Patent number 7,989,927
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate
- Patent number 7,981,798
- Issue date Jul 19, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package
- Patent number 7,960,820
- Issue date Jun 14, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 7,948,092
- Issue date May 24, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package, semiconductor apparatus, and methods...
- Patent number 7,897,510
- Issue date Mar 1, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 7,894,201
- Issue date Feb 22, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card
- Patent number 7,888,953
- Issue date Feb 15, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- G01 - MEASURING TESTING
Information Patent Grant
Light emitting apparatus and manufacturing method therefor
- Patent number 7,876,036
- Issue date Jan 25, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device housing and a manufacturing method thereof, a...
- Patent number 7,850,344
- Issue date Dec 14, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 7,838,897
- Issue date Nov 23, 2010
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
BOBBIN FOR THERMAL TRANSFER SHEET OR IMAGE-RECEIVING SHEET, ASSEMBL...
- Publication number 20170080724
- Publication date Mar 23, 2017
- DAI NIPPON PRINTING CO., LTD.
- Shigeta MORI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTER
- Publication number 20160046131
- Publication date Feb 18, 2016
- Akira TAKAHASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTER
- Publication number 20140071194
- Publication date Mar 13, 2014
- Yutaka Inokuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...
- Publication number 20120086116
- Publication date Apr 12, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wiring Substrate Manufacturing Method and Wiring Substrate
- Publication number 20110272821
- Publication date Nov 10, 2011
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20110227218
- Publication date Sep 22, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156242
- Publication date Jun 30, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE AND OP...
- Publication number 20110150405
- Publication date Jun 23, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori SHIRAISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110032710
- Publication date Feb 10, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING APPARATUS
- Publication number 20100321936
- Publication date Dec 23, 2010
- SHINKO ELECTRICAL INDUSTRIES CO., LTD.
- Mitsutoshi HIGASHI
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20100289155
- Publication date Nov 18, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro SUNOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20100289140
- Publication date Nov 18, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro SUNOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100207218
- Publication date Aug 19, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...
- Publication number 20100193939
- Publication date Aug 5, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND...
- Publication number 20100155862
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20100155928
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100038772
- Publication date Feb 18, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100001304
- Publication date Jan 7, 2010
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD
- Publication number 20090284276
- Publication date Nov 19, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
PRINTER
- Publication number 20090232574
- Publication date Sep 17, 2009
- CITIZEN HOLDINGS CO., LTD.
- Akira TAKAHASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20090141464
- Publication date Jun 4, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090115049
- Publication date May 7, 2009
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20090108411
- Publication date Apr 30, 2009
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DIVIDING METHOD
- Publication number 20090098712
- Publication date Apr 16, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090095974
- Publication date Apr 16, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20090093117
- Publication date Apr 9, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20090081867
- Publication date Mar 26, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HEAT RADIATION PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20090039379
- Publication date Feb 12, 2009
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and semiconductor device fabrication method
- Publication number 20090014735
- Publication date Jan 15, 2009
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for producing the same and electronic device
- Publication number 20080241997
- Publication date Oct 2, 2008
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yuichi TAGUCHI

Person

Patents Grantslast 30 patents

Bobbin for thermal transfer sheet or image-receiving sheet, assembl...

Printer

Electronic component device, method of manufacturing the same and w...

Printer

Package for electronic component, manufacturing method thereof and...

Method of manufacturing optical waveguide, optical waveguide and op...

Heat radiation package and semiconductor device

Wiring board and electronic component device

Semiconductor package and manufacturing method of the same

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package and manufacturing method of the semiconductor...

Electronic component device, and method of manufacturing the same

Semiconductor device having an element mounted on a substrate and a...

Silicon substrate for package

Lighting apparatus

Semiconductor package and manufacturing method thereof

Light-emitting device and method for manufacturing the same

Wiring substrate with a wire terminal

Printer with recording paper leading edge storage unit

Silicon substrate for package

Method of manufacturing substrate

Semiconductor package

Electronic component and method for manufacturing the same

Semiconductor device package, semiconductor apparatus, and methods...

Electronic component and method for manufacturing the same

Probe card

Light emitting apparatus and manufacturing method therefor

Light emitting device housing and a manufacturing method thereof, a...

Light-emitting device and method for manufacturing the same

Patents Applicationslast 30 patents

BOBBIN FOR THERMAL TRANSFER SHEET OR IMAGE-RECEIVING SHEET, ASSEMBL...

PRINTER

PRINTER

ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...

Wiring Substrate Manufacturing Method and Wiring Substrate

SILICON SUBSTRATE FOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE AND OP...

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHTING APPARATUS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...

PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

PROBE CARD

PRINTER

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

SEMICONDUCTOR PACKAGE

SILICON SUBSTRATE FOR PACKAGE

SUBSTRATE DIVIDING METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SUBSTRATE

METHOD OF MANUFACTURING SUBSTRATE

HEAT RADIATION PACKAGE AND SEMICONDUCTOR DEVICE

Semiconductor device and semiconductor device fabrication method

Interposer and method for producing the same and electronic device