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Yuichi Takada
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Tualatin, OR, US
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last 30 patents
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Patent Grant
Deposit morphology of electroplated copper
Patent number
8,197,662
Issue date
Jun 12, 2012
Novellus Systems, Inc.
Eric Webb
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Wafer electroplating apparatus for reducing edge defects
Patent number
8,172,992
Issue date
May 8, 2012
Novellus Systems, Inc.
Vinay Prabhakar
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Deposit morphology of electroplated copper
Patent number
7,879,218
Issue date
Feb 1, 2011
Novellus Systems, Inc.
Eric Webb
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS
Publication number
20120181170
Publication date
Jul 19, 2012
Vinay Prabhakar
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS
Publication number
20100155254
Publication date
Jun 24, 2010
Vinay Prabhakar
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR