Yuichi Yokoyama

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Widened conductive line structures and staircase structures for sem...
- Patent number 11,950,403
- Issue date Apr 2, 2024
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive units and methods of forming capacitive units
- Patent number 11,875,947
- Issue date Jan 16, 2024
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode contact for a vertical three-dimensional memory
- Patent number 11,849,573
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Yuichi Yokoyama
Information Patent Grant
Support pillars for vertical three-dimensional (3D) memory
- Patent number 11,476,254
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of capacitors and method used in forming an array of capacitors
- Patent number 11,309,314
- Issue date Apr 19, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated memory and integrated assemblies
- Patent number 10,535,661
- Issue date Jan 14, 2020
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated memory and integrated assemblies
- Patent number 10,312,241
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, RELATED MEM...
- Publication number 20240164083
- Publication date May 16, 2024
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE CONTACT FOR A VERTICAL THREE-DIMENSIONAL MEMORY
- Publication number 20240074144
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yuichi Yokoyama
Information Patent Application
Capacitive Units and Methods of Forming Capacitive Units
- Publication number 20220328249
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220320000
- Publication date Oct 6, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- G11 - INFORMATION STORAGE
Information Patent Application
SUPPORT PILLARS FOR VERTICAL THREE-DIMENSIONAL (3D) MEMORY
- Publication number 20220246618
- Publication date Aug 4, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Of Capacitors And Method Used In Forming An Array Of Capacitors
- Publication number 20220208771
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDENED CONDUCTIVE LINE STRUCTURES AND STAIRCASE STRUCTURES FOR SEM...
- Publication number 20220130830
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE CONTACT FOR A VERTICAL THREE-DIMENSIONAL MEMORY
- Publication number 20220077150
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Of Capacitors And Method Used In Forming An Array Of Capacitors
- Publication number 20220028862
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Memory and Integrated Assemblies
- Publication number 20190348417
- Publication date Nov 14, 2019
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS

Yuichi Yokoyama

Person

Patents Grantslast 30 patents

Widened conductive line structures and staircase structures for sem...

Capacitive units and methods of forming capacitive units

Bottom electrode contact for a vertical three-dimensional memory

Support pillars for vertical three-dimensional (3D) memory

Array of capacitors and method used in forming an array of capacitors

Integrated memory and integrated assemblies

Integrated memory and integrated assemblies

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, RELATED MEM...

BOTTOM ELECTRODE CONTACT FOR A VERTICAL THREE-DIMENSIONAL MEMORY

Capacitive Units and Methods of Forming Capacitive Units

Integrated Assemblies and Methods of Forming Integrated Assemblies

SUPPORT PILLARS FOR VERTICAL THREE-DIMENSIONAL (3D) MEMORY

Array Of Capacitors And Method Used In Forming An Array Of Capacitors

WIDENED CONDUCTIVE LINE STRUCTURES AND STAIRCASE STRUCTURES FOR SEM...

BOTTOM ELECTRODE CONTACT FOR A VERTICAL THREE-DIMENSIONAL MEMORY

Array Of Capacitors And Method Used In Forming An Array Of Capacitors

Integrated Memory and Integrated Assemblies