Yuichiro Noguchi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting apparatus and parallelism detection method in mounting app...
- Patent number 12,018,936
- Issue date Jun 25, 2024
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and film supply apparatus
- Patent number 11,848,219
- Issue date Dec 19, 2023
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for linearly moving first and second moving bodie...
- Patent number 11,469,125
- Issue date Oct 11, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,393,700
- Issue date Jul 19, 2022
- Yamaha Motor Robotics Holdings Co., Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,024,596
- Issue date Jun 1, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma apparatus and method for producing the same
- Patent number 10,573,525
- Issue date Feb 25, 2020
- Shinkawa Ltd.
- Tetsuya Utano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING DEVICE, AND METHOD FOR DETECTING DEGREE OF PARALLELISM OF...
- Publication number 20240318958
- Publication date Sep 26, 2024
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230274951
- Publication date Aug 31, 2023
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND PARALLELISM DETECTION METHOD IN MOUNTING APP...
- Publication number 20220412733
- Publication date Dec 29, 2022
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND FILM SUPPLY APPARATUS
- Publication number 20210242051
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210005570
- Publication date Jan 7, 2021
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20200388507
- Publication date Dec 10, 2020
- Yamaha Motor Robotics Holdings Co., Ltd.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIE...
- Publication number 20200279762
- Publication date Sep 3, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR POSITIONING FIRST OBJECT IN RELATION TO SECON...
- Publication number 20200251369
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Tetsuya UTANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20130240146
- Publication date Sep 19, 2013
- SHINKAWA LTD.
- Tetsuya Utano
- H01 - BASIC ELECTRIC ELEMENTS

Yuichiro Noguchi

Person

Patents Grantslast 30 patents

Mounting apparatus and parallelism detection method in mounting app...

Mounting apparatus and film supply apparatus

Device and method for linearly moving first and second moving bodie...

Apparatus and method for linearly moving movable body relative to o...

Bonding apparatus and bonding method

Device and method for positioning first object in relation to secon...

Bonding apparatus and bonding method

Plasma apparatus and method for producing the same

Patents Applicationslast 30 patents

MOUNTING DEVICE, AND METHOD FOR DETECTING DEGREE OF PARALLELISM OF...

MOUNTING DEVICE AND MOUNTING METHOD

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

MOUNTING APPARATUS AND PARALLELISM DETECTION METHOD IN MOUNTING APP...

MOUNTING APPARATUS AND FILM SUPPLY APPARATUS

BONDING APPARATUS AND BONDING METHOD

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

BONDING DEVICE AND BONDING METHOD

DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIE...

DEVICE AND METHOD FOR POSITIONING FIRST OBJECT IN RELATION TO SECON...

PLASMA APPARATUS AND METHOD FOR PRODUCING THE SAME