Yuichiro SHISHIDO

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive film, method of manufacturing semiconductor device, and se...
- Patent number 9,105,754
- Issue date Aug 11, 2015
- Nitto Denko Corporation
- Yuichiro Shishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bond film, dicing die bond film, and semiconductor device
- Patent number 8,779,586
- Issue date Jul 15, 2014
- Nitto Denko Corporation
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing film for semiconductor device
- Patent number 8,658,515
- Issue date Feb 25, 2014
- Nitto Denko Corporation
- Koichi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing film with protecting film
- Patent number 8,614,139
- Issue date Dec 24, 2013
- Nitto Denko Corporation
- Yuichiro Shishido
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ME...
- Publication number 20240409786
- Publication date Dec 12, 2024
- NITTO DENKO CORPORATION
- Satoshi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SHEET
- Publication number 20230125153
- Publication date Apr 27, 2023
- NITTO DENKO CORPORATION
- Akiko TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170140972
- Publication date May 18, 2017
- Nitto Denko Corporation
- Ryuichi KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING FILM WITH PROTECTING FILM
- Publication number 20140106106
- Publication date Apr 17, 2014
- Nitto Denko Corporation
- Yuichiro Shishido
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCTION OF SEALED BODY, FRAME-SHAPED SPACER FOR PRODU...
- Publication number 20140083760
- Publication date Mar 27, 2014
- Nitto Denko Corporation
- Tsuyoshi TORINARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SE...
- Publication number 20140001654
- Publication date Jan 2, 2014
- Yuichiro Shishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120231557
- Publication date Sep 13, 2012
- Koichi INOUE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING FILM WITH PROTECTING FILM
- Publication number 20120231236
- Publication date Sep 13, 2012
- Yuichiro SHISHIDO
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20110217501
- Publication date Sep 8, 2011
- Yuichiro Shishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE
- Publication number 20110210455
- Publication date Sep 1, 2011
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...
- Publication number 20110190421
- Publication date Aug 4, 2011
- Yuta KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084413
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084408
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yuichiro SHISHIDO

Person

Patents Grantslast 30 patents

Adhesive film, method of manufacturing semiconductor device, and se...

Die bond film, dicing die bond film, and semiconductor device

Method of manufacturing film for semiconductor device

Dicing film with protecting film

Patents Applicationslast 30 patents

PROTECTIVE SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ME...

BONDING SHEET

LAMINATED BODY AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

DICING FILM WITH PROTECTING FILM

METHOD FOR PRODUCTION OF SEALED BODY, FRAME-SHAPED SPACER FOR PRODU...

ADHESIVE FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SE...

METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE

DICING FILM WITH PROTECTING FILM

DICING DIE-BONDING FILM

DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE

ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...

THERMOSETTING DIE-BONDING FILM

THERMOSETTING DIE-BONDING FILM