Yuichiro YAMASHITA

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with photosensitivity enhancement region
- Patent number 12,062,671
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,776,983
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 11,728,366
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SPAD image sensor and associated fabricating method
- Patent number 11,264,525
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SPAD image sensor and associated fabricating method
- Patent number 11,239,383
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 11,227,889
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and associated fabricating method
- Patent number 11,127,774
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage free image sensor and method of the same
- Patent number 11,063,080
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 10,991,747
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device having color filter arrays and image processing...
- Patent number 10,951,866
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing image sensor
- Patent number 10,700,117
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage free image sensor and method of the same
- Patent number 10,692,914
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SPAD image sensor and associated fabricating method
- Patent number 10,672,934
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SPAD image sensor and associated fabricating method
- Patent number 10,636,930
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 10,510,789
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and associated fabricating method
- Patent number 10,373,999
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 10,276,618
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rerouting method and a structure for stacked image sensors
- Patent number 10,269,854
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode device and manufacturing method thereof
- Patent number 10,205,037
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SPAD image sensor and associated fabricating method
- Patent number 10,204,950
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage free image sensor and method of the same
- Patent number 10,177,187
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method for manufacturing the same
- Patent number 10,163,959
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,153,320
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor array and manufacturing method of the same
- Patent number 10,032,814
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlens for a phase detection auto focus (PDAF) pixel of a compos...
- Patent number 10,002,899
- Issue date Jun 19, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Keng-Yu Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging apparatus having same exposure period for signals held in s...
- Patent number 10,002,894
- Issue date Jun 19, 2018
- Canon Kabushiki Kaisha
- Yuichiro Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image pickup apparatus, image pickup system, and image pickup appar...
- Patent number 9,985,060
- Issue date May 29, 2018
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing image sensor structure having wide contact
- Patent number 9,978,805
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 9,954,022
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device, image sensor array and manufacturing method of senso...
- Patent number 9,923,013
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20240387594
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION
- Publication number 20240363653
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230369374
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20230335572
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING A GATE DIELECTRIC STRUCTURE FOR IMPROVED DEVICE...
- Publication number 20230261021
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION
- Publication number 20220406823
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DIODE DESIGN
- Publication number 20220278161
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20220059583
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20210225908
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANT DAMAGE FREE IMAGE SENSOR AND METHOD OF THE SAME
- Publication number 20200303431
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20200303433
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD
- Publication number 20200279969
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU-JUI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD
- Publication number 20200227582
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20200066770
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD
- Publication number 20190355775
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20190214414
- Publication date Jul 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANT DAMAGE FREE IMAGE SENSOR AND METHOD OF THE SAME
- Publication number 20190139999
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD
- Publication number 20190131478
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU-JUI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING IMAGE SENSOR
- Publication number 20190109164
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD
- Publication number 20190103433
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD
- Publication number 20190103504
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND IMAGE PROCESSING METHOD
- Publication number 20190020857
- Publication date Jan 17, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTODIODE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358488
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20180204862
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20180151619
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR ARRAY AND MANUFACTURING METHOD OF THE SAME
- Publication number 20180145098
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- YUICHIRO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rerouting Method and a Structure for Stacked Image Sensors
- Publication number 20170309667
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING IMAGE SENSOR STRUCTURE HAVING WIDE CONTACT
- Publication number 20170200763
- Publication date Jul 13, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Jui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL UNIT CELL HAVING CONVERSION CIRCUIT
- Publication number 20170142364
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170141145
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS

Yuichiro YAMASHITA

Person

Patents Grantslast 30 patents

Image sensor with photosensitivity enhancement region

Image sensor

Extra doped region for back-side deep trench isolation

SPAD image sensor and associated fabricating method

SPAD image sensor and associated fabricating method

Extra doped region for back-side deep trench isolation

Image sensor and associated fabricating method

Implant damage free image sensor and method of the same

Image sensor

Image sensor device having color filter arrays and image processing...

Method for manufacturing image sensor

Implant damage free image sensor and method of the same

SPAD image sensor and associated fabricating method

SPAD image sensor and associated fabricating method

Extra doped region for back-side deep trench isolation

Image sensor and associated fabricating method

Extra doped region for back-side deep trench isolation

Rerouting method and a structure for stacked image sensors

Photodiode device and manufacturing method thereof

SPAD image sensor and associated fabricating method

Implant damage free image sensor and method of the same

Image sensor and method for manufacturing the same

Semiconductor device and method of forming the same

Image sensor array and manufacturing method of the same

Microlens for a phase detection auto focus (PDAF) pixel of a compos...

Imaging apparatus having same exposure period for signals held in s...

Image pickup apparatus, image pickup system, and image pickup appar...

Method for manufacturing image sensor structure having wide contact

Extra doped region for back-side deep trench isolation

Sensor device, image sensor array and manufacturing method of senso...

Patents Applicationslast 30 patents

IMAGE SENSOR

IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION

IMAGE SENSOR

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

IMAGE SENSOR HAVING A GATE DIELECTRIC STRUCTURE FOR IMPROVED DEVICE...

IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION

BACKSIDE DIODE DESIGN

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

IMAGE SENSOR

IMPLANT DAMAGE FREE IMAGE SENSOR AND METHOD OF THE SAME

IMAGE SENSOR

SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD

SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

IMPLANT DAMAGE FREE IMAGE SENSOR AND METHOD OF THE SAME

SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD

METHOD FOR MANUFACTURING IMAGE SENSOR

IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD

SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD

IMAGE SENSOR DEVICE AND IMAGE PROCESSING METHOD

PHOTODIODE DEVICE AND MANUFACTURING METHOD THEREOF

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

IMAGE SENSOR ARRAY AND MANUFACTURING METHOD OF THE SAME

Rerouting Method and a Structure for Stacked Image Sensors

METHOD FOR MANUFACTURING IMAGE SENSOR STRUCTURE HAVING WIDE CONTACT

PIXEL UNIT CELL HAVING CONVERSION CIRCUIT

IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME