Yuji Fukano

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded structure including a performance-optimized support chip and...
- Patent number 11,011,506
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Naohiro Hosoda
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device containing channels with laterally...
- Patent number 10,964,715
- Issue date Mar 30, 2021
- SanDisk Technologies LLC
- Manabu Kakazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stacking using vertical interconnection by throug...
- Patent number 10,957,680
- Issue date Mar 23, 2021
- SanDisk Technologies LLC
- Shinsuke Yada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a deformation-resistant e...
- Patent number 10,833,100
- Issue date Nov 10, 2020
- SanDisk Technologies LLC
- Kenji Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure including a performance-optimized support chip and...
- Patent number 10,665,580
- Issue date May 26, 2020
- SanDisk Technologies LLC
- Naohiro Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a deformation-resistant e...
- Patent number 10,665,607
- Issue date May 26, 2020
- SanDisk Technologies LLC
- Kenji Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing multi-threshold-voltage...
- Patent number 10,347,647
- Issue date Jul 9, 2019
- SanDisk Technologies LLC
- Naohiro Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing support pillars undernea...
- Patent number 10,141,331
- Issue date Nov 27, 2018
- SanDisk Technologies LLC
- Hiromasa Susuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional NAND memory having improved connection between so...
- Patent number 9,711,532
- Issue date Jul 18, 2017
- SanDisk Technologies LLC
- Masato Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional NAND memory having improved connection between so...
- Patent number 9,530,781
- Issue date Dec 27, 2016
- SanDisk Technologies LLC
- Masato Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical NAND device containing peripheral devices on epitaxial sem...
- Patent number 9,305,934
- Issue date Apr 5, 2016
- SanDisk Technologies Inc.
- Hao Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED STRUCTURE INCLUDING A PERFORMANCE-OPTIMIZED SUPPORT CHIP AND...
- Publication number 20200258876
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING CHANNELS WITH LATERALLY...
- Publication number 20200251485
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Manabu KAKAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A DEFORMATION-RESISTANT E...
- Publication number 20200235123
- Publication date Jul 23, 2020
- SANDISK TECHNOLOGIES LLC
- Kenji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUG...
- Publication number 20200227397
- Publication date Jul 16, 2020
- SANDISK TECHNOLOGIES LLC
- Shinsuke YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-THRESHOLD-VOLTAGE...
- Publication number 20190198515
- Publication date Jun 27, 2019
- SanDisk Technologies LLC
- Naohiro HOSODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SUPPORT PILLARS UNDERNEA...
- Publication number 20180342531
- Publication date Nov 29, 2018
- SanDisk Technologies LLC
- Hiromasa Susuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL NAND MEMORY HAVING IMPROVED CONNECTION BETWEEN SO...
- Publication number 20170033121
- Publication date Feb 2, 2017
- SanDisk Technologies LLC
- Masato Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL NAND MEMORY HAVING IMPROVED CONNECTION BETWEEN SO...
- Publication number 20160181264
- Publication date Jun 23, 2016
- SANDISK TECHNOLOGIES INC.
- Masato Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NAND DEVICE CONTAINING PERIPHERAL DEVICES ON EPITAXIAL SEM...
- Publication number 20160111436
- Publication date Apr 21, 2016
- SanDisk Technologies, Inc.
- Hao DING
- H01 - BASIC ELECTRIC ELEMENTS

Yuji Fukano

Person

Patents Grantslast 30 patents

Bonded structure including a performance-optimized support chip and...

Three-dimensional memory device containing channels with laterally...

Semiconductor die stacking using vertical interconnection by throug...

Three-dimensional memory device including a deformation-resistant e...

Bonded structure including a performance-optimized support chip and...

Three-dimensional memory device including a deformation-resistant e...

Three-dimensional memory device containing multi-threshold-voltage...

Three-dimensional memory device containing support pillars undernea...

Three dimensional NAND memory having improved connection between so...

Three dimensional NAND memory having improved connection between so...

Vertical NAND device containing peripheral devices on epitaxial sem...

Patents Applicationslast 30 patents

BONDED STRUCTURE INCLUDING A PERFORMANCE-OPTIMIZED SUPPORT CHIP AND...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING CHANNELS WITH LATERALLY...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A DEFORMATION-RESISTANT E...

SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUG...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-THRESHOLD-VOLTAGE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SUPPORT PILLARS UNDERNEA...

THREE DIMENSIONAL NAND MEMORY HAVING IMPROVED CONNECTION BETWEEN SO...

THREE DIMENSIONAL NAND MEMORY HAVING IMPROVED CONNECTION BETWEEN SO...

VERTICAL NAND DEVICE CONTAINING PERIPHERAL DEVICES ON EPITAXIAL SEM...