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Yuji Hasegawa

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  • Hitachi-shi, JP
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Patents Applicationslast 30 patents

  • Information Patent Application

    Resin Paste For Die Bonding And Its Use
    • Publication number 20070290369
    • Publication date Dec 20, 2007
    • HITACHI CHEMICAL CO., LTD.
    • Yuji Hasegawa
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    Resin Paste for Die Bonding
    • Publication number 20070225438
    • Publication date Sep 27, 2007
    • Yuji Hasegawa
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...