Yuji Hasegawa

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin paste for die bonding, containing a polyurethaneimide resin a...
- Patent number 8,212,370
- Issue date Jul 3, 2012
- Hitachi Chemical Company, Ltd.
- Syuichi Mori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20100155969
- Publication date Jun 24, 2010
- Syuichi Mori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...