Yuji Ichimura

Person

Matsumoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,640,926
- Issue date May 2, 2023
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,430,707
- Issue date Aug 30, 2022
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,177,224
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Toshio Denta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition
- Patent number 10,597,526
- Issue date Mar 24, 2020
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composite, semiconductor device, and method of manufacturing...
- Patent number 10,106,683
- Issue date Oct 23, 2018
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and electronic component
- Patent number 10,077,385
- Issue date Sep 18, 2018
- Fuji Electric Co., Ltd.
- Kotomi Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicone resin composition for sealant and power semiconductor modu...
- Patent number 9,617,455
- Issue date Apr 11, 2017
- Fuji Electric Co., Ltd.
- Makoto Higashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,548,253
- Issue date Jan 17, 2017
- Fuji Electric Co., Ltd.
- Kei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing and evaluation method of a semiconductor device
- Patent number 9,355,943
- Issue date May 31, 2016
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,123,639
- Issue date Sep 1, 2015
- Fuji Electric Co., Ltd.
- Daisuke Kimijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 9,035,446
- Issue date May 19, 2015
- Fuji Electric Co., Ltd.
- Daisuke Kimijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure detecting apparatus
- Patent number 7,234,358
- Issue date Jun 26, 2007
- Fuji Electric Device Technology Co., Ltd.
- Kazunori Saito
- G01 - MEASURING TESTING
Information Patent Grant
Resin sealed semiconductor device with improved structural integrity
- Patent number 5,606,200
- Issue date Feb 25, 1997
- Fuji Electric Co., Ltd.
- Kouichi Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200357753
- Publication date Nov 12, 2020
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20200185291
- Publication date Jun 11, 2020
- Fuji Electric Co., Ltd.
- Yuji ICHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200091025
- Publication date Mar 19, 2020
- Fuji Electric Co., Ltd.
- Yuji ICHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION
- Publication number 20170275453
- Publication date Sep 28, 2017
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING...
- Publication number 20170240744
- Publication date Aug 24, 2017
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20170233620
- Publication date Aug 17, 2017
- Fuji Electric Co., Ltd.
- Kotomi Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SILICONE RESIN COMPOSITION FOR SEALANT AND POWER SEMICONDUCTOR MODU...
- Publication number 20160333239
- Publication date Nov 17, 2016
- Fuji Electric Co., Ltd.
- Makoto HIGASHIDATE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MANUFACTURING AND EVALUATION METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20160211201
- Publication date Jul 21, 2016
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20150115428
- Publication date Apr 30, 2015
- Fuji Electric Co., Ltd.
- Daisuke KIMIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150069601
- Publication date Mar 12, 2015
- Fuji Electric Co., Ltd.
- Kei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20140319669
- Publication date Oct 30, 2014
- Fuji Electric Co., Ltd.
- Daisuke KIMIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140210060
- Publication date Jul 31, 2014
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure detecting apparatus
- Publication number 20060243054
- Publication date Nov 2, 2006
- Fuji Electric Device Technology Co., Ltd.
- Kazunori Saito
- G01 - MEASURING TESTING

Yuji Ichimura

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method and semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Resin composition

Resin composite, semiconductor device, and method of manufacturing...

Resin composition and electronic component

Silicone resin composition for sealant and power semiconductor modu...

Semiconductor device and method of manufacturing the same

Manufacturing and evaluation method of a semiconductor device

Power semiconductor module

Power module

Pressure detecting apparatus

Resin sealed semiconductor device with improved structural integrity

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RESIN COMPOSITION

RESIN COMPOSITE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING...

RESIN COMPOSITION AND ELECTRONIC COMPONENT

SILICONE RESIN COMPOSITION FOR SEALANT AND POWER SEMICONDUCTOR MODU...

MANUFACTURING AND EVALUATION METHOD OF A SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER MODULE

SEMICONDUCTOR DEVICE

Pressure detecting apparatus