Yuji Inatani

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Sakura-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board assembly and method for producing same
- Patent number 10,237,971
- Issue date Mar 19, 2019
- Fujikura Ltd.
- Ryotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer circuit board, and multi-layer...
- Patent number 8,884,166
- Issue date Nov 11, 2014
- Fujikura Ltd.
- Yuji Inatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, multilayer wiring board, and method for manufacturing...
- Patent number 7,926,175
- Issue date Apr 19, 2011
- Fujikura Ltd.
- Toshihiko Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD ASSEMBLY AND METHOD FOR PRODUCING SAME
- Publication number 20160205765
- Publication date Jul 14, 2016
- FUJIKURA LTD.
- Ryotaro TAKAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD, AND MULTI-LAYER...
- Publication number 20130098662
- Publication date Apr 25, 2013
- FUJIKURA LTD.
- Yuji Inatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING...
- Publication number 20080016685
- Publication date Jan 24, 2008
- FUJIKURA LTD.
- Toshihiko Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, multilayer wiring board, and method for manufacturing...
- Publication number 20060249833
- Publication date Nov 9, 2006
- FUJIKURA LTD.
- Toshihiko Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR