Yuji Ishino

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Patents Applicationslast 30 patents

Information Patent Application
Copper Foil, Laminate, and Flexible Printed Wiring Board
- Publication number 20240215153
- Publication date Jun 27, 2024
- JX Metals Corporation
- Yuji Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil, Laminate, and Flexible Printed Wiring Board
- Publication number 20240215154
- Publication date Jun 27, 2024
- JX Metals Corporation
- Yuji Ishino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...