Yuji Kawamata

Person

Tochigi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder paste
- Patent number 12,194,573
- Issue date Jan 14, 2025
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sliding member, bearing, sliding member manufacturing method, and b...
- Patent number 12,031,579
- Issue date Jul 9, 2024
- Senju Metal Industry Co., Ltd.
- Naoki Sato
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Information processing apparatus, information processing system, fe...
- Patent number 11,889,042
- Issue date Jan 30, 2024
- Ricoh Company, Ltd.
- Yuji Kawamata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flux and solder paste
- Patent number 11,826,860
- Issue date Nov 28, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 11,819,955
- Issue date Nov 21, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 11,813,686
- Issue date Nov 14, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, and solder...
- Patent number 11,571,770
- Issue date Feb 7, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet conveying device and image forming apparatus incorporating th...
- Patent number 11,492,223
- Issue date Nov 8, 2022
- Ricoh Company, Ltd.
- Yuji Kawamata
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 11,377,715
- Issue date Jul 5, 2022
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material
- Patent number 10,888,957
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joining member, solder material, solder paste, formed solder, flux...
- Patent number 10,675,719
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flux composition for solder applications
- Patent number 10,610,979
- Issue date Apr 7, 2020
- Senju Metal Industry Co., Ltd.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material, solder joint, and method of manufacturing the sold...
- Patent number 10,173,287
- Issue date Jan 8, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy having reduced shrinkage cavities
- Patent number 9,227,258
- Issue date Jan 5, 2016
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for lead-free solder and soldering method
- Patent number 9,073,154
- Issue date Jul 7, 2015
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indium-containing lead-free solder for vehicle-mounted electronic c...
- Patent number 8,888,932
- Issue date Nov 18, 2014
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder for vehicles and a vehicle-mounted electronic circ...
- Patent number 8,845,826
- Issue date Sep 30, 2014
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting soldering flux and soldering process
- Patent number 6,402,013
- Issue date Jun 11, 2002
- Senju Metal Industry Co., Ltd.
- Hisayuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for soldering using solder preforms
- Patent number 5,932,030
- Issue date Aug 3, 1999
- Sony Corporation
- Hiroyuki Fukasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN MOLDED ARTICLE AND METHOD FOR DETERMINING DETERIORATION OF RE...
- Publication number 20250003828
- Publication date Jan 2, 2025
- Yuji KAWAMATA
- G01 - MEASURING TESTING
Information Patent Application
SLIDING MEMBER AND BEARING
- Publication number 20240337291
- Publication date Oct 10, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Naoki SATO
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SLIDING MEMBER, BEARING, SLIDING MEMBER MANUFACTURING METHOD, AND B...
- Publication number 20240309913
- Publication date Sep 19, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Naoki SATO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SLIDING MEMBER, BEARING, SLIDING MEMBER MANUFACTURING METHOD, AND B...
- Publication number 20240044368
- Publication date Feb 8, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Naoki SATO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, FE...
- Publication number 20230308586
- Publication date Sep 28, 2023
- RICOH COMPANY, LTD.
- Yuji Kawamata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, AN...
- Publication number 20230306746
- Publication date Sep 28, 2023
- RICOH COMPANY, LTD.
- Yuji KAWAMATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20230089879
- Publication date Mar 23, 2023
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...
- Publication number 20220250194
- Publication date Aug 11, 2022
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, AND SOLDER...
- Publication number 20220088721
- Publication date Mar 24, 2022
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20220088725
- Publication date Mar 24, 2022
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...
- Publication number 20220090232
- Publication date Mar 24, 2022
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...
- Publication number 20220088723
- Publication date Mar 24, 2022
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS INCORPORATING TH...
- Publication number 20200231397
- Publication date Jul 23, 2020
- RICOH COMPANY, LTD.
- Yuji KAWAMATA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Flux
- Publication number 20180339375
- Publication date Nov 29, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Material, Solder Joint, and Method for Inspecting Solderi...
- Publication number 20180281118
- Publication date Oct 4, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...
- Publication number 20180015572
- Publication date Jan 18, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Solder Material, Solder Joint, and Method of Manufacturing the Sold...
- Publication number 20170252871
- Publication date Sep 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Flux-Coated Ball and Method of Manufacturing the Same
- Publication number 20170182601
- Publication date Jun 29, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cu Core Ball
- Publication number 20160148885
- Publication date May 26, 2016
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES
- Publication number 20110204121
- Publication date Aug 25, 2011
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC C...
- Publication number 20100307823
- Publication date Dec 9, 2010
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER FOR VEHICLES AND AN VEHICLE-MOUNTED ELECTRONIC CIR...
- Publication number 20100294565
- Publication date Nov 25, 2010
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...
- Publication number 20100090323
- Publication date Apr 15, 2010
- Lintec Corporation
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...
- Publication number 20100025837
- Publication date Feb 4, 2010
- LINTEC CORPORATION
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux for lead-free solder and soldering Method
- Publication number 20090308496
- Publication date Dec 17, 2009
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosetting soldering flux and soldering process
- Publication number 20010019075
- Publication date Sep 6, 2001
- Hisayuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yuji Kawamata

Person

Patents Grantslast 30 patents

Solder paste

Sliding member, bearing, sliding member manufacturing method, and b...

Information processing apparatus, information processing system, fe...

Flux and solder paste

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Solder alloy, solder paste, solder ball, solder preform, and solder...

Sheet conveying device and image forming apparatus incorporating th...

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Soldering material

Cu column, Cu core column, solder joint, and through-silicon via

Joining member, solder material, solder paste, formed solder, flux...

Flux composition for solder applications

Solder material, solder joint, and method of manufacturing the sold...

Cu core ball

Lead-free solder alloy having reduced shrinkage cavities

Flux for lead-free solder and soldering method

Indium-containing lead-free solder for vehicle-mounted electronic c...

Lead-free solder for vehicles and a vehicle-mounted electronic circ...

Thermosetting soldering flux and soldering process

Flux for soldering using solder preforms

Patents Applicationslast 30 patents

RESIN MOLDED ARTICLE AND METHOD FOR DETERMINING DETERIORATION OF RE...

SLIDING MEMBER AND BEARING

SLIDING MEMBER, BEARING, SLIDING MEMBER MANUFACTURING METHOD, AND B...

SLIDING MEMBER, BEARING, SLIDING MEMBER MANUFACTURING METHOD, AND B...

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, FE...

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, AN...

FLUX AND SOLDER PASTE

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, AND SOLDER...

SOLDER PASTE

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...

SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS INCORPORATING TH...

Flux

Soldering Material, Solder Joint, and Method for Inspecting Solderi...

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

Solder Material, Solder Joint, and Method of Manufacturing the Sold...

Flux-Coated Ball and Method of Manufacturing the Same

Cu Core Ball

LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES

INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC C...

LEAD-FREE SOLDER FOR VEHICLES AND AN VEHICLE-MOUNTED ELECTRONIC CIR...

COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...

COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...

Flux for lead-free solder and soldering Method

Thermosetting soldering flux and soldering process