Yuji Kunimoto

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 10,477,703
- Issue date Nov 12, 2019
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and semiconductor device
- Patent number 9,824,963
- Issue date Nov 21, 2017
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,736,941
- Issue date Aug 15, 2017
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,646,926
- Issue date May 9, 2017
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,412,687
- Issue date Aug 9, 2016
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 9,332,658
- Issue date May 3, 2016
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing the same, and semiconduct...
- Patent number 9,198,290
- Issue date Nov 24, 2015
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method
- Patent number 8,941,230
- Issue date Jan 27, 2015
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, method of manufacturing the same, and semiconduct...
- Patent number 8,907,489
- Issue date Dec 9, 2014
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,736,073
- Issue date May 27, 2014
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine wiring package and method of manufacturing the same
- Patent number 8,530,753
- Issue date Sep 10, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a semiconductor element buried in an in...
- Patent number 8,410,614
- Issue date Apr 2, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed package and method of producing the same
- Patent number 8,399,977
- Issue date Mar 19, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,318,543
- Issue date Nov 27, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with lead pins and method of producing the same
- Patent number 8,314,347
- Issue date Nov 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,110,921
- Issue date Feb 7, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate
- Patent number 7,598,608
- Issue date Oct 6, 2009
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20190191572
- Publication date Jun 20, 2019
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20170179013
- Publication date Jun 22, 2017
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160276259
- Publication date Sep 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150364405
- Publication date Dec 17, 2015
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...
- Publication number 20150053460
- Publication date Feb 26, 2015
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...
- Publication number 20150048505
- Publication date Feb 19, 2015
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307113
- Publication date Nov 21, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...
- Publication number 20130069251
- Publication date Mar 21, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110221069
- Publication date Sep 15, 2011
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20100219522
- Publication date Sep 2, 2010
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-SEALED PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20100155925
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE WIRING PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100155126
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME
- Publication number 20100147561
- Publication date Jun 17, 2010
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100123239
- Publication date May 20, 2010
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100120204
- Publication date May 13, 2010
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING SUBSTRATE
- Publication number 20070252286
- Publication date Nov 1, 2007
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Yuji Kunimoto

Person

Patents Grantslast 30 patents

Wiring board

Electronic part embedded substrate and method of producing an elect...

Wiring board, and semiconductor device

Electronic part embedded substrate and method of producing an elect...

Wiring substrate

Wiring substrate and method of manufacturing the same

Chip embedded substrate and method of producing the same

Wiring substrate and method of manufacturing the same

Wiring board, semiconductor device, and method for manufacturing wi...

Wiring substrate, method of manufacturing the same, and semiconduct...

Semiconductor package and manufacturing method

Wiring substrate, method of manufacturing the same, and semiconduct...

Chip embedded substrate and method of producing the same

Semiconductor device

Fine wiring package and method of manufacturing the same

Semiconductor device having a semiconductor element buried in an in...

Resin-sealed package and method of producing the same

Method of manufacturing semiconductor device

Wiring board with lead pins and method of producing the same

Semiconductor package and method of manufacturing the same

Chip embedded substrate and method of producing the same

Mounting substrate

Patents Applicationslast 30 patents

WIRING BOARD

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

WIRING BOARD, AND SEMICONDUCTOR DEVICE

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...

RESIN-SEALED PACKAGE AND METHOD OF PRODUCING THE SAME

FINE WIRING PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

MOUNTING SUBSTRATE