Yuji MIMURA

Person

Koshi City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Separating method, separating apparatus, and separating system
- Patent number 12,157,293
- Issue date Dec 3, 2024
- Tokyo Electron Limited
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Measuring method and measuring device
- Patent number 11,791,182
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding method for cleaning non-bonding surface of substrate
- Patent number 11,626,302
- Issue date Apr 11, 2023
- Tokyo Electron Limited
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding system with cleaning apparatus for cleaning non-bonding sur...
- Patent number 11,424,142
- Issue date Aug 23, 2022
- Tokyo Electron Limited
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for low density silicon oxide for fusion bondi...
- Patent number 11,315,789
- Issue date Apr 26, 2022
- Tokyo Electron Limited
- Kiyotaka Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating apparatus
- Patent number 9,401,291
- Issue date Jul 26, 2016
- Tokyo Electron Limited
- Yuji Mimura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20250029950
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS
- Publication number 20240234363
- Publication date Jul 11, 2024
- TOKYO ELECTRON LIMITED
- Scott LEFEVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS
- Publication number 20240170444
- Publication date May 23, 2024
- TOKYO ELECTRON LIMITED
- Scott LEFEVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFYING METHOD AND SURFACE MODIFYING APPARATUS
- Publication number 20240079214
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFYING APPARATUS AND BONDING STRENGTH DETERMINATION METHOD
- Publication number 20240079222
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Takashi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM
- Publication number 20230055853
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING SYSTEM AND INSPECTION METHOD OF INSPECTING COMBINED SUBSTRATE
- Publication number 20220415673
- Publication date Dec 29, 2022
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING SYSTEM AND SURFACE MODIFICATION METHOD
- Publication number 20220384386
- Publication date Dec 1, 2022
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD FOR CLEANING NON-BONDING SURFACE OF SUBSTRATE
- Publication number 20220351987
- Publication date Nov 3, 2022
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEASURING METHOD AND MEASURING DEVICE
- Publication number 20210249287
- Publication date Aug 12, 2021
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method And Structure for Low Density Silicon Oxide for Fusion Bondi...
- Publication number 20200343092
- Publication date Oct 29, 2020
- TOKYO ELECTRON LIMITED
- Kiyotaka Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20200294824
- Publication date Sep 17, 2020
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bonding System
- Publication number 20180019225
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
- Publication number 20160155721
- Publication date Jun 2, 2016
- TOKYO ELECTRON LIMITED
- Kenji SUGAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING APPARATUS
- Publication number 20150128858
- Publication date May 14, 2015
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Yuji MIMURA

Person

Patents Grantslast 30 patents

Separating method, separating apparatus, and separating system

Measuring method and measuring device

Bonding method for cleaning non-bonding surface of substrate

Bonding system with cleaning apparatus for cleaning non-bonding sur...

Method and structure for low density silicon oxide for fusion bondi...

Bonding systems

Bonding method, storage medium, bonding apparatus and bonding system

Coating apparatus

Patents Applicationslast 30 patents

BONDING METHOD AND BONDING SYSTEM

BONDING LAYER AND PROCESS

BONDING LAYER AND PROCESS

SURFACE MODIFYING METHOD AND SURFACE MODIFYING APPARATUS

SURFACE MODIFYING APPARATUS AND BONDING STRENGTH DETERMINATION METHOD

SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM

BONDING SYSTEM AND INSPECTION METHOD OF INSPECTING COMBINED SUBSTRATE

BONDING SYSTEM AND SURFACE MODIFICATION METHOD

BONDING METHOD FOR CLEANING NON-BONDING SURFACE OF SUBSTRATE

MEASURING METHOD AND MEASURING DEVICE

Method And Structure for Low Density Silicon Oxide for Fusion Bondi...

BONDING SYSTEM AND BONDING METHOD

Bonding System

Bonding Method, Storage Medium, Bonding Apparatus and Bonding System

COATING APPARATUS