Yuji Miyazaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of double-side polishing wafer
- Patent number 11,648,640
- Issue date May 16, 2023
- Sumco Corporation
- Yuji Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Power semiconductor module and power conversion device
- Patent number 11,355,477
- Issue date Jun 7, 2022
- Mitsubishi Electric Corporation
- Takeshi Horiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,601,307
- Issue date Mar 24, 2020
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,483,965
- Issue date Nov 19, 2019
- Mitsubishi Electric Corporation
- Yuji Miyazaki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power semiconductor module and power conversion device
- Patent number 9,979,314
- Issue date May 22, 2018
- Mitsubishi Electric Corporation
- Yoshiko Obiraki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module and power conversion device
- Patent number 9,685,879
- Issue date Jun 20, 2017
- Mitsubishi Electric Corporation
- Yoshiko Obiraki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Driving circuit and semiconductor device
- Patent number 9,094,012
- Issue date Jul 28, 2015
- Mitsubishi Electric Corporation
- Mituharu Tabata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High power semiconductor device
- Patent number 8,455,997
- Issue date Jun 4, 2013
- Mitsubishi Electric Corporation
- Hidetoshi Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch matrix drive circuit for a power element
- Patent number 8,040,162
- Issue date Oct 18, 2011
- Mitsubishi Electric Corporation
- Yuji Miyazaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FO...
- Publication number 20240261929
- Publication date Aug 8, 2024
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240186287
- Publication date Jun 6, 2024
- Mitsubishi Electric Corporation
- Haruhiko MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTIN...
- Publication number 20240123566
- Publication date Apr 18, 2024
- SUMCO CORPORATION
- Yuji MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20230106784
- Publication date Apr 6, 2023
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20220184772
- Publication date Jun 16, 2022
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366886
- Publication date Nov 25, 2021
- Mitsubishi Electric Corporation
- Akiyoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING WAFER
- Publication number 20200353585
- Publication date Nov 12, 2020
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
- Publication number 20200286864
- Publication date Sep 10, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Takeshi HORIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200083801
- Publication date Mar 12, 2020
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190372570
- Publication date Dec 5, 2019
- Mitsubishi Electric Corporation
- Yuji Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
- Publication number 20160172995
- Publication date Jun 16, 2016
- Mitsubishi Electric Corporation
- Yoshiko Obiraki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DRIVING CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20150061731
- Publication date Mar 5, 2015
- Mitsubishi Electric Corporation
- Mituharu TABATA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
- Publication number 20150023081
- Publication date Jan 22, 2015
- MITSUBISHI ELECTRIC CORPORATION
- Yoshiko Obiraki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120261811
- Publication date Oct 18, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Hidetoshi NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100149774
- Publication date Jun 17, 2010
- MITSUBISHI ELECTRIC CORPORATION
- Masafumi Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVE CIRCUIT FOR POWER ELEMENT
- Publication number 20100141304
- Publication date Jun 10, 2010
- Mitsubishi Electric Corporation
- Yuji Miyazaki
- H03 - BASIC ELECTRONIC CIRCUITRY

Yuji Miyazaki

Person

Patents Grantslast 30 patents

Method of double-side polishing wafer

Power semiconductor module and power conversion device

Semiconductor device and method for manufacturing the same

Semiconductor device

Power semiconductor module and power conversion device

Power semiconductor module and power conversion device

Driving circuit and semiconductor device

High power semiconductor device

Switch matrix drive circuit for a power element

Patents Applicationslast 30 patents

DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FO...

SEMICONDUCTOR DEVICE

PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTIN...

APPARATUS FOR DOUBLE-SIDE POLISHING WORK

METHOD AND APPARATUS FOR DOUBLE-SIDE POLISHING WORK

SEMICONDUCTOR DEVICE

METHOD OF DOUBLE-SIDE POLISHING WAFER

POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

DRIVING CIRCUIT AND SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DRIVE CIRCUIT FOR POWER ELEMENT