Yuji NAGUMO

Person

Nisshin-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Processed wafer and method of manufacturing chip formation wafer
- Patent number 11,881,407
- Issue date Jan 23, 2024
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201632
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Yuji NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250054875
- Publication date Feb 13, 2025
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240162092
- Publication date May 16, 2024
- DENSO CORPORATION
- YUJI NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240038711
- Publication date Feb 1, 2024
- DENSO CORPORATION
- TERUAKI KUMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240038590
- Publication date Feb 1, 2024
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240030056
- Publication date Jan 25, 2024
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230268230
- Publication date Aug 24, 2023
- DENSO CORPORATION
- FUMIHITO TACHIBANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230268185
- Publication date Aug 24, 2023
- DENSO CORPORATION
- Hiroyuki TAKAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230197519
- Publication date Jun 22, 2023
- DENSO CORPORATION
- YUJI NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230178497
- Publication date Jun 8, 2023
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...
- Publication number 20230154987
- Publication date May 18, 2023
- DENSO CORPORATION
- HIROKI TSUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER
- Publication number 20220130675
- Publication date Apr 28, 2022
- DENSO CORPORATION
- Masatake NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS

Yuji NAGUMO

Person

Patents Grantslast 30 patents

Processed wafer and method of manufacturing chip formation wafer

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...

PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER