Yuji Nishitani

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 7,880,317
- Issue date Feb 1, 2011
- Sony Corporation
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic component mounting structure, and electron...
- Patent number 7,436,682
- Issue date Oct 14, 2008
- Sony Computer Entertainment Inc.
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,420,127
- Issue date Sep 2, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,288,724
- Issue date Oct 30, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip circuit module and method for producing the same
- Patent number 7,193,311
- Issue date Mar 20, 2007
- Sony Corporation
- Tsuyoshi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate device, method for producing the same, semiconduc...
- Patent number 7,138,294
- Issue date Nov 21, 2006
- Sony Corporation
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction structure and junction method for conductive projection
- Patent number 7,053,315
- Issue date May 30, 2006
- Sony Corporation
- Ken Orui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a multi-chip circuit module including a multi-...
- Patent number 6,919,226
- Issue date Jul 19, 2005
- Sony Corporation
- Tsuyoshi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate device, method for producing the same, semiconduc...
- Patent number 6,831,357
- Issue date Dec 14, 2004
- Sony Corporation
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,803,324
- Issue date Oct 12, 2004
- Sony Corporation
- Tsuyoshi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer printed wiring board
- Patent number 6,637,105
- Issue date Oct 28, 2003
- Sony Corporation
- Yoshio Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080185712
- Publication date Aug 7, 2008
- SONY CORPORATION
- Fujio Kanayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070293038
- Publication date Dec 20, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, electronic component mounting structure, and electron...
- Publication number 20070119618
- Publication date May 31, 2007
- Yuji Nishitani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070102191
- Publication date May 10, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20050142852
- Publication date Jun 30, 2005
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Junction structure and junction method for conductive projection
- Publication number 20050056445
- Publication date Mar 17, 2005
- Ken Orui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-chip circuit module and method for producing the same
- Publication number 20040201085
- Publication date Oct 14, 2004
- Tsuyoshi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate device, method for producing the same, semiconduc...
- Publication number 20040171190
- Publication date Sep 2, 2004
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-chip circuit module and method for producing the same
- Publication number 20040056344
- Publication date Mar 25, 2004
- Tsuyoshi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20040003494
- Publication date Jan 8, 2004
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate device, method for producing the same, semiconduc...
- Publication number 20030214027
- Publication date Nov 20, 2003
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030162386
- Publication date Aug 28, 2003
- Tsuyoshi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yuji Nishitani

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Wiring board, electronic component mounting structure, and electron...

Method of manufacturing multilayer wiring substrate, and multilayer...

Method of manufacturing multilayer wiring substrate, and multilayer...

Multi-chip circuit module and method for producing the same

Circuit substrate device, method for producing the same, semiconduc...

Junction structure and junction method for conductive projection

Method for producing a multi-chip circuit module including a multi-...

Circuit substrate device, method for producing the same, semiconduc...

Semiconductor device and its manufacturing method

Method of manufacturing a multilayer printed wiring board

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing multilayer wiring substrate, and multilayer...

Wiring board, electronic component mounting structure, and electron...

Method of manufacturing multilayer wiring substrate, and multilayer...

Method of manufacturing multilayer wiring substrate, and multilayer...

Junction structure and junction method for conductive projection

Multi-chip circuit module and method for producing the same

Circuit substrate device, method for producing the same, semiconduc...

Multi-chip circuit module and method for producing the same

Method of manufacturing multilayer wiring substrate, and multilayer...

Circuit substrate device, method for producing the same, semiconduc...

Semiconductor device and its manufacturing method