Yuji Nitta

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sapphire wafer dividing method
- Patent number 8,518,730
- Issue date Aug 27, 2013
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting method and cutting apparatus
- Patent number 7,347,766
- Issue date Mar 25, 2008
- Disco Corporation
- Yuji Nitta
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SAPPHIRE WAFER DIVIDING METHOD
- Publication number 20120083059
- Publication date Apr 5, 2012
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cutting method and cutting apparatus
- Publication number 20070066188
- Publication date Mar 22, 2007
- Yuji Nitta
- B28 - WORKING CEMENT, CLAY, OR STONE