Yuji Ohashi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method
- Patent number 5,078,312
- Issue date Jan 7, 1992
- Kabushiki Kaisha Shinkawa
- Yuji Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for detecting height of bonding surface
- Patent number 5,046,655
- Issue date Sep 10, 1991
- Kabushiki Kaisha Shinkawa
- Yuji Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic wire bonding apparatus
- Patent number 5,046,654
- Issue date Sep 10, 1991
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 5,016,803
- Issue date May 21, 1991
- Kabushiki Kaisha Shinkawa
- Yuji Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR