Yuji Ootani

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Okazaki-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Conductor composition, a mounting substrate and a mounting structur...
- Patent number 7,807,073
- Issue date Oct 5, 2010
- Denso Corporation
- Masashi Totokawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductor composition, a mounting substrate and a mounting structur...
- Patent number 7,276,185
- Issue date Oct 2, 2007
- Denso Corporation
- Masashi Totokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including bonded wire based to electronic part...
- Patent number 6,731,001
- Issue date May 4, 2004
- Denso Corporation
- Kan Kinouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting method
- Patent number 6,601,752
- Issue date Aug 5, 2003
- Denso Corporation
- Yukihiro Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of electronic parts and mounting method of elect...
- Patent number 6,326,239
- Issue date Dec 4, 2001
- Denso Corporation
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste composition including conductive metallic powder
- Patent number 6,174,462
- Issue date Jan 16, 2001
- Denso Corporation
- Kengo Oka
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
Conductor composition, a mounting substrate and a mounting structur...
- Publication number 20070224511
- Publication date Sep 27, 2007
- DENSO CORPORATION
- Masashi Totokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Conductor composition, a mounting substrate and a mounting structur...
- Publication number 20050127536
- Publication date Jun 16, 2005
- Masashi Totokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device including bonding wire bonded to electronic pa...
- Publication number 20020020910
- Publication date Feb 21, 2002
- Kan Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting method
- Publication number 20010020635
- Publication date Sep 13, 2001
- Yukihiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS