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Yuji Otani
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Okazaki, JP
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last 30 patents
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Patent Grant
Method of producing thick multi-layer substrates
Patent number
5,593,722
Issue date
Jan 14, 1997
Nippondenso Co., Ltd.
Yuji Otani
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Ceramic multi-layer wiring board
Patent number
5,562,973
Issue date
Oct 8, 1996
Nippondenso Co. Ltd.
Takashi Nagasaka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic circuit device
Patent number
5,483,217
Issue date
Jan 9, 1996
Nippondenso Co., Ltd.
Takashi Nagasaka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR